A new angle on printing
! !
Figure 11. Interaction plot for 0.49 area ratio apertures. Figure 12. Interval plot for 0.49 area ratio apertures.
!
!
Figure 13. Visual inspection results—comparison of 0.15 mm pads/0.15 mm
spacing.
Figure 14. Main effects plot for visual ranking.
Another DoE is therefore in
progress to further investigate
the lower limit.
4. A lower area ratio can be used
to print 01005s if the blade an-
gle is optimized. This will allow
designers to more efficiently
place these components on a
circuit board, or alternatively,
allow SMT engineers to use a
thicker stencil to print 01005s.
Using a thicker stencil would
! !
in turn allow for a larger range
Figure 15. Best transfer efficiency for 0.37 AR. Figure 16. Worst transfer efficiency for 0.37 AR.
of components on the PCB
with a single print process and/
or widen the process window and allows for angle changes for different to better characterize the overall 01005
for a diverse component set on conditions, such as after a stencil wipe, process and have recommendations for an
a specific PCB. breaks, or paste dispense. extensive range of process parameters.
This tool substantially refines the
Having the ability to program the contact
process for printing fine features. To
angle, and vary it for different process
further examine this, additional studies are
requirements, is a valuable tool for the pro-
planned to evaluate the effect of transfer Assembléon is introducing a new screen printer,
cess engineer faced with these increasingly
efficiency while focusing on optimizing the YGP, for short cycle-time applications that
difficult challenges in SMT. The Assem-
stencil thickness, evaluating type 3, 4 and varies the squeegee contact angle in software,
bléon YGP printer offers this functionality
5 solder pastes, as well as optimizing pick depositing the exact amount of solder needed by
without requiring blade changes. This fact
& place and reflow processes. Once these each component.
eliminates the potential for set-up errors,
studies are complete, we should be able
www.globalsmt.net Global SMT & Packaging – February 2009 – 39
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