SMT HYBRID PACKAGING 2015 SHOW PREVIEW
Meeting place for experts in electronics manufacturing
SMT Hybrid Packaging 2015, the International Exhibition and Congress for System Integration in Micro Electronics, takes place at the Exhibition Centre Nuremberg, Germany, from 5th – 7th May 2015. This is a must attend event for everyone involved in the field of micro electronics manufacturing in Europe. Here’s some of the highlights for this year’s must attend event
T
he latest developments across the entire process chain of electronics
manufacturing will be showcased at this year’s SMT Hybrid Packaging exhibition 2015. For exhibitors and visitors, it is the premier industry event in the field of system integration in micro electronics. An interesting aspect of the exhibition is
the high quality of the trade visitors. According to a survey, 90% of visitors play a key or advisory role in investment decisions.
THE CONFERENCE The SMT Hybrid Packaging conference is an important platform for information and networking in the field of micro electronics manufacturing in Europe. The conference offers internationally renowned experts an excellent platform in order to talk about new technologies and innovative applications and find answers to vital questions. Arrange your personal education program within the scope of SMT Hybrid Packaging individually.
WORKSHOP - MANUFACTURING THE INTERNET OF THINGS Running along side the SMT Hybrid Packaging conference, the “Manufacturing the Internet of Things” workshop will also be taking place. Analysing the impact of Industry 4.0 on the electronics manufacturing industry, it offers a deep insights into the opportunities and requirements for the EMS supply chain and will be taking place from 05.05.2015, 09:00 – 17:00. From today to 2020 the network of “connected things” communicating over the Internet will grow from some 5 billion to 26 billion, more than 500 billion “things” are expected to be connected by 2030. As a market with burgeoning potential and still yet very much untapped it is important to understand who will manufacture these “things” that comprise a critical function of the Internet of Things (IoT). This workshop will analyse the impact on the electronics manufacturing industry,
electronics manufacturing supply chain. Key workshop attendees are from the
electronic manufacturing supply chain, including industry players and IoT leaders in their field, responsible for business development, technology development and strategy. In the morning session industry experts
will present their up-to-date knowledge. The results of the workshop will be summarised and made available to all participants for use in further discussions.
TOPICS OF DISCUSSION INCLUDE: • The Internet of Things - the non-linear opportunity for the supply chain
• Materials and their supply chain for IoT devices and infrastructure
• The Internet of Things - opportunity and challenges for the semiconductor industry
• Components to Cloud - how IOT changes the market
• Applications and Infrastructure - a dualistic view on the development and deployment of the IoT
• Short introduction on IoT and its applications • Discussion of IoT nodes and infrastructure, including the usage of IoT in industry and in manufacturing, and the development and manufacturing of IoT nodes based on techniques such as Smart Systems Integration.
providing a thorough insights into the opportunities and requirements for the EMS supply chain manufacturing the Internet of Things. In the introductory presentation session
the current topics in systems, devices and components enabling the Internet of Things will be highlighted. Typical requirements for IoT devices and applications will be shared as well as proposed benefits for consumers and businesses. A first introduction of the impact of IoT on the supply chain will be presented.
The afternoon session
comprises a guided discussion amongst the participants with the target of jointly developing an initial framework for understanding of the implications for the
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• Discussion of IoT application support by an IoT “platform”, including application driven data collection and storage, data fusion, security and privacy and data access and ownership, including legal and regulatory aspects, specific user requirements and standardisation options.
“The SMT Hybrid Packaging conference
is an important platform for information and
networking in the field of micro electronics manufacturing in Europe”
THE AFTERNOON WORKSHOP SESSION 1. Scoping scenarios for the “Supply chain for IoT devices”, with active involvement of the workshop participants 2. Identifying paths of joint action for further describing the requirements and opportunities of the supply chain. SMT Hybrid Packaging offers global
companies the ideal platform to reach out to expert visitors and exhibitors from many countries and to establish and strengthen business relations.
SMT Hybrid Packaging
www.smt-exhibition.com +49 711 61946-27
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