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MEMS MANUFACTURING FEATURE


world. Once that model is established, a schematic vs. 3D comparison is needed to ensure the MEMS model used in circuit development is accurate. By leveraging the capabilities of new reliability verification tools that can link together the ability to perform circuit classification, physical layout measurements, complex calculations, and rule-driven circuit checking, the specific curvatures of the devices and interconnects can be verified against the designer’s intent. Simulating MEMS device behaviour uncovers an additional challenge— parasitic extraction. Traditional parasitic extraction tools are rule-based or table- based methodologies, and are developed with certain assumptions about the physical layout. These tools are developed to support the interconnect that exists in IC designs; therefore, they are optimised for rectilinear geometries and parallel and orthogonal routes. These assumptions fail when the tool encounters the complex geometries found in MEMs designs. MEMS circuits require the type of accuracy that is only available from a field solver. Advanced extraction solutions that combine true field solver technology with the performance and scaling of modern parasitic extraction tools must be used. Extraction tools with these capabilities


design kits, MEMS IP libraries, and reference flows from foundries. Test engineers need to incorporate appropriate environmental tests. In short, the changing MEMS market


calls for nothing short of a new silicon and software ecosystem—much of it based on the fabless model familiar to IC design companies—to enable designers to turn out products for the cost-driven, high-volume consumer market. By integrating the power of mechanical


can provide designers the verification accuracy required for these MEMS circuits while maintaining targeted tape-out cycles. Testing requirements also differ


considerably. Traditional ICs typically use a single generic tester for most electrical tests. MEMS devices typically require a series of tests, which can include physical stimuli such as mechanical shock, variable frequency vibration testing, and temperature cycling. Standard qualification tests such as high and low temperature operating life ensure long- term reliability. Foundries need to provide standardised


MEMS processes, and collaborate with fabless MEMS design houses to meet time-to-market and high-volume demands. Designers also need process


Figure 2: LTC4120 Receive


Demoboard Components


and optical functions with silicon, MEMS devices can add significant functionality without the need for transistor scaling. However, the success of integrated chips will depend in large part on the ability to ensure reliable, cost-efficient products can be produced in high volume in a timely manner. That goal, in turn, depends on the ability of the foundries and EDA vendors to provide the designers with the processes, data, and tools they need to create integrated ICs that combine the advantages of MEMS and silicon circuitry to satisfy the emerging market demand.


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