News from Vision 2014
3D scanner developed with adaptive resolution
Fraunhofer researchers have developed a 3D laser scanner that can focus on key sections of an image and capture them at a higher resolution. Te Fraunhofer Institute for Photonic Microsystems (IPMS) developed the MEMS scanning technology for the system, which it presented at Vision in Stuttgart from 4 to 6 November. Tree Fraunhofer institutes,
including the IPMS, worked on the adaptive 3D imaging system. Te device is able to adjust the image section extremely quickly according to what part of the image the eye is focusing on. Tis means the viewer can see small sections of an overall image in greater focus. Efficient soſtware algorithms
analyse a quickly recorded 3D overview image and direct the scanner to interesting image sections, so they can be scanned at a high resolution. Tis is the first time that situation-
based high-quality 3D information can be obtained within such a short time period, according to the researchers. Te scanning system concept
is based on a 1D MEMS array that performs resonant scanning in a vertical direction, which can be pivoted and rotated with a conventional electro-dynamic drive.
Ximea cameras featuring Thunderbolt interface
Vision 2014 in Stuttgart saw the first cameras displayed with a Tunderbolt interface. Tere were also products exhibited compatible with the Camera Link HS high-speed standard, which, while the standard was ratified in May 2012, are the first products for the standard. Tunderbolt is a joint development by Apple
and Intel which is becoming more widespread in consumer electronics. Allied Vision and Ximea were both
demonstrating Tunderbolt cameras, although Allied Vision’s model was a prototype and the company has not yet disclosed whether the product will be made available. Allied Vision said it ‘sees high potential in this new interface [Tunderbolt] for machine vision, especially for multi-camera operation’. Tunderbolt 2 achieves up to 20Gb/s, which is 20 times GigE bandwidth and four times USB 3.0. With such a throughput, high frame rates would be possible even with high resolution sensors. Another advantage of Tunderbolt is that, like
of 2.3 megapixels at 12 bits per pixel at 128fps, or 10 bits per pixel at 165fps. Te camera has a data throughput of 10Gb/s. Teledyne Dalsa, Matrox Imaging, and Silicon
Soſtware were all showing products complying with Camera Link HS. Te standard, which caters for high bandwidth data transfer, originated from HS Link, a protocol developed by Teledyne Dalsa for its high-speed vision products. Teledyne Dalsa exhibited its Piranha XL 16k CMOS TDI camera and its Xtium-CLHS PX4 frame grabber at the trade fair, both compatible with CLHS. Te Piranha XL 16k monochrome
Thunderbolt is a joint development by Apple and Intel
camera delivers 125kHz line rate, operating at 2GB/s data throughput using a single CX4 cable, while the Xtium-CLHS PX4 frame grabber is a PCIe Gen 2 board with up to seven CLHS data lanes to capture aggregate data rates of 2.1GB/s. Both products are ideal for
integration into flat panel, electronics, and semiconductor inspection systems, among other machine vision applications. Matrox Imaging released the Radient eV-CLHS
with FireWire, it is possible to network up to six cameras with each other in a chain with only one end of the chain connected to the host. Tis makes Tunderbolt attractive for high-performance multi-camera image-processing systems. Ximea was displaying xiLab Tunderbolt
Optical scan head with integrated MEMS scanning mirror array
cameras equipped with the sensors from Sony (IMX174) and Cmosis (CMV20000). Te MT200 model is based on the 20 megapixel Cmosis sensor, which can achieve 30 frames per second in the 12-bit mode thanks to the 20Gb/s interface. Te MT023 camera incorporates a Sony IMX174 sensor, delivering full sensor resolution
8 Imaging and Machine Vision Europe • December 2014/January 2015
frame grabber at Vision in Stuttgart, while Silicon Soſtware was displaying its MicroEnable 5 PCIe x8/Gen 2-based image acquisition and processing board. Te Radient eV-CLHS supports the Camera
Link HS (v1.0) M-Protocol through a CX4 copper connection. It provides a single C2 7M1 connection for data transfers up to 2.1GB/s at cable lengths up to 15 metres. Te card is equipped with a PCIe 2.0 x8 host interface and up to 4GB SDRAM of on-board buffering. Te frame grabber has been tested for full compatibility with Teledyne Dalsa CLHS cameras.
@imveurope
www.imveurope.com
Thunderbolt and Camera Link HS products shown at Vision 2014
Fraunhofer IPMS
Ximea
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