NEWS REVIEW
Infineon’s 300mm CoolMOS silicon chips now shipping globally
INFINEON TECHNOLOGIES AG says it has achieved a major breakthrough in the manufacturing of power semiconductors on 300 millimetre thin wafers.
In February, the company received the first customer go-aheads for products of the CoolMOS family produced by the 300 millimetre (mm) line at the Villach (Austria) site. The production process based on the new technology has completed qualification from start to finish and customers have given the go-ahead.
Infineon believes its revolutionary silicon CoolMOS power family sets new standards in the field of energy efficiency. Using high voltage MOSFETs, CoolMOS offers a significant reduction of conduction and switching losses and enables high power density and efficiency for superior power conversion systems.
CoolMOS products are application specific and optimised for consumer products, renewable energy, telecom power supply, adapters and many others. “Infineon put its faith in this manufacturing technology very early on and continued to invest even in economically difficult times. We think and act with foresight and are now reaping the benefits: The qualification of our entire 300mm line represents a veritable leap ahead of the competition,” says Reinhard Ploss, CEO of Infineon Technologies AG. “300mm thin-wafer manufacturing for power semiconductors will enable us, with the corresponding demand, to seize the opportunities that the market offers.”
Infineon says it is the first and only company worldwide to produce power semiconductors on 300mm thin wafers. Thanks to their larger diameter compared to standard 200mm wafers, two-and-a- half times as many chips can be made from each one.
The next step is for the present manufacturing concept for CoolMOS products, qualified from start to finish, with the front-end site Villach and assembly of the thin chips at the back-end site Malacca (Malaysia), to be expanded to the front-end site Dresden. Here the focus is on high-volume production in a fully automated 300mm line.
The basis for the processes required and the manufacturing technology is currently
being developed in research projects in Dresden. The technology transfer to Dresden is running on schedule and qualification of the first CoolMOS products will be completed in March.
Shortly, in Villach more power semiconductor technologies will be transferred to the 300mm line and produced. The development of the next power technology generation will focus on 300 instead of 200mm technology.
With these solutions customers can reduce development times and put new, more powerful products on the market more quickly. 300mm thin- wafer technology guarantees that in the future Infineon will continue to be able to produce sufficient quantities at competitive costs.
Martin L. Edelman jumps on board at AMD
AMD has appointed Martin Edelman to the company’s board of directors as a representative of West Coast Hitech L.P., an affiliate of Mubadala Development Company and AMD’s largest stockholder. Edelman’s appointment follows the resignation of Waleed al Muhairi after four years of service on the AMD Board.
Edelman currently serves as Of Counsel, Real Estate Department for the law firm Paul, Hastings, Janofsky & Walker LLP, a New York City law firm where he is responsible for
real estate transactions as well as corporate mergers and acquisitions. He serves as a member of the board of directors at several private and public companies, including Avis Budget Group, Ashford Hospitality Trust and Capital Trust.
Edelman is also a senior advisor to Mubadala Development Company, a strategic investment and development company headquartered in Abu Dhabi. He brings an extensive legal background to the board of directors, with more than 40 years of experience in the legal profession.
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