NEWS REVIEW AGC and nMode collaborate


TOKYO-BASED Asahi Glass Co., Ltd. (AGC) and nMode Solutions Inc. of Tucson, Arizona, have invested $2.1 million to co found a subsidiary business, Triton Micro Technologies. The new company will develop innovative via-fill technology for interposers, enabling next- generation semiconductor packaging solutions using ultra-thin glass.


Headquartered in Tucson with a manufacturing facility planned in California, the subsidiary will combine nMode’s interposer technology for electrically connecting semiconductor devices with AGC’s materials technology and micro-hole drilling techniques to produce 2.5-dimensional (2.5D) and three-dimensional (3D) through-glass-via (TGV) interposers needed for advanced semiconductor devices. To achieve the next generation in high-density semiconductor packaging, interposer


technologies are needed to form the high number of electrical connections between a silicon chip and a printed circuit board. Interposers allow high packaging integration in the smallest available form factors.


Triton will manufacture ultra-thin glass interposers using a high-efficiency continuous process that lowers costs and helps to commercialize the widespread use of interposers. The company will draw upon nMode’s intellectual property and AGC’s carrier-glass technology and via-hole drilling methodologies to fabricate its interposers. Triton will then apply its proprietary technology to fill the high-aspect-ratio via holes with a copper paste that has the same coefficient of thermal expansion as glass. This reduces the potentially damaging effects of thermal stress during manufacturing and long-term use. Triton’s process


Axcelis wins order from major


memory & flash device maker He continues, “The Purion M was selected after an extensive evaluation focused on implant accuracy, purity and repeatability; key requirements to achieve the customer’s most challenging demands for emerging new device architectures. The system’s innovative angle control system provides significant advantages over the competition in this critical area.”


AXCELIS TECHNOLOGIES has announced that its Purion M medium current implanter has been selected by one of the world’s leading chipmakers. The system will be used to develop and manufacture next generation memory and FLASH devices.


Bill Bintz, executive vice president of product development, engineering and marketing comments, “We’re very excited about this, new win and the growth opportunities the system provides Axcelis.”


“In addition, the Purion M effectively demonstrated its ability to maintain the industry’s highest levels of productivity,


beyond the traditional operating range for medium current implanters, resulting in unmatched levels of manufacturing flexibility and capital efficiency, significantly reducing their implant bay operating costs,” Blintz adds.


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creates high-quality electrodes within the interposer to provide the electrical interface capable of accommodating advanced, high-density ICs. Triton’s interposers are compatible with wafers having diameters from 100mm to 300mm and thicknesses of 0.7mm and below. The company can also design and manufacture customised solutions for unique applications.


“The global semiconductor industry recognises that silicon is approaching its performance limits as an interposer material, but the need remains to create smaller, more efficient packages for today’s and tomorrow’s high- performance ICs,” comments Tim Mobley, CEO at Triton. “Our technology allows us to achieve known-good-die testing at the highest levels of packaging integration, faster cycle times and the lowest cost per unit in the market.”


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