INDUSTRY ANALYSIS
Cu pillar and micro-bumping flip-chip platforms invigorates the market
OVER THE NEXT FIVE YEARS, wafer growth is expected to triple for the Flip-Chip platform, which will reach over 40 million of 12’’eq wspy by 2018.
This is according to Yole Développement’s “Flip Chip Market and Technology Trends” report, which updates the business status of the Flip-Chip market including data for TIM, underfills, substrates and Flip-Chip bonders.
Despite its high 19 percent CAGR, Flip-chip is not new - in fact, it was first introduced by IBM over 30 years ago. As such, it would be easy to consider it an old, uninteresting, mature technology but this is far from true. Instead, Flip- Chip is keeping up with the times and developing new bumping solutions to serve the most advanced technologies, like 3DIC and 2.5D.
Indeed, no matter what packaging technology you’re using, a bumping step is always required at the end. In 2012, bumping technologies accounted for a massive 81 percent of the total installed capacity in the middle end area. This represents over 14 million 12’’eq wafers. What’s more, fab loading rates are high, especially for the Cu pillar platform (88 percent).
Flip-Chip is also big on value: in 2012 it was a $20 billion market (making it the biggest market in the middle-end area), and Yole expects it to continue growing at 9 percent, ultimately reaching $35 billion by 2018.
Flip-Chip capacity is expected to grow over the next five years to meet large demand from three main areas. These are CMOS 28nm IC, including new applications like APE and BB, next generation DDR memory and 3DIC/2.5D interposer using micro-bumping.
Driven by these applications, Cu pillar is on its way to becoming the interconnect of choice for Flip-Chip.
In addition to traditional applications which have used Flip-Chip for a while now (laptop, desktop and their CPUs,
GPUs & Chipsets - which are growing slowly but still represent significant production volumes for Flip-Chip), Yole’s analyst expects to see strong demand from mobile & wireless (smartphones), consumer applications (tablets, smart TV, set top box), computing and high performance/ industrial applications such as network, servers, data centres and HPC.
The new “Flip-Chip packaged ICs” are expected to radically alter the market landscape with new specific motivations that will drive demand for wafer bumping. “In the context of 3D integration and the “More than Moore” approach, Flip-Chip is one of the key technology bricks and
will help enable more sophisticated system on chip integration than ever before,” says Lionel Cadix, Market & Technology Analyst, Advanced Packaging, at Yole Développement.
Flip-Chip is being reshaped by a new kind of demand that is hungry for Cu pillars and micro-bumps, which are on their way to becoming the new mainstream bumping metallurgy for die interconnection.
Meanwhile, Cu pillar is fast becoming interconnect of choice for advanced CMOS (less than 28nm), memory, and micro-bumping for 2.5D interposer and 3DIC.
Issue I 2013
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