NEWS REVIEW
EV Group ships 300mm wafer bonding system to China
EV GROUP (EVG), a supplier of wafer bonding and lithography equipment, has announced that it has installed a fully automated 300-mm system from EVG’s Gemini product family of integrated wafer bonding clusters to a leading Chinese semiconductor foundry. This customer will use the system for 3D IC integration and advanced packaging-two high- volume applications.
“This order from one of the largest Chinese foundries further cements EV Group’s position as the market and technology leader in wafer bonding for leading-edge applications,” stated Hermann Waltl, executive sales and customer support director at EV Group.
“China is an important market for us, and this order is further testament to our continued success in penetrating leading high-volume microelectronics manufacturers in China-from advanced substrate suppliers to light emitting diode (LED) and semiconductor device makers.”
imec announce launch of integrated
silicon photonics
EVG won this order following a competitive bid with other leading process equipment suppliers.
Reasons cited by the customer for choosing EVG included high alignment accuracy, comprehensive process development and support, successful demo results in EVG cleanrooms, unmatched expertise in wafer bonding and other high-volume process solutions, and a technology roadmap that is strongly aligned with that of the customer.
Brewer Science upgrades production
LITHOGRAPHY INNOVATOR Brewer Science has installed a scale-up reactor to increase production of its CNTRENE C100 family of electronics-grade carbon nanotube (CNT) materials by tenfold. Such materials are used in chemical and biological sensors and nanotube-based non-volatile random access memory (RAM) device applications, which require extremely low levels of metal ion contaminants with concentration limits in parts per billion.
CNT technology is developing at a rapid rate and is quickly becoming a worthy rival to silicon in memory applications. “Small-scale reaction equipment can only take manufacturing so far with respect to quality and delivery time. This new scale- up reactor will provide the capability to complete weeks of reactions in three days while producing materials that meet stringent microelectronics specifications,” says Stephen Gibbons, Director of Technology of Brewer Science’s Carbon Electronics Centre.
Jim Lamb, Director of Business Development for the Carbon Electronics Centre adds, ‘’With increasing customer usage and the move toward commercial adoption in devices, we needed to implement our third round of scale-up to support market demand. Growth of our CNTRENE C100 family of products is driven by their use in nanotube-based non-volatile random access memory devices, a universal CNT memory structure developed by Nantero, Inc., sold under the name NRAM, which could replace embedded memory, DRAM, SRAM, and flash memory devices.”
“This structure allows flexible placement of memory in the device stack and can be stacked for vertically placed memory cells. NRAM devices provide other key benefits including robustness, 3-nanosecond write speeds, low operating power, radiation-hardened memory cells, and the ability to perform at high operating temperatures,” continues Lamb.
platform NANOELECTRONICS research centre imec has announced the launch of its fully integrated silicon photonics platform through a cost-sharing Multi-Project Wafer (MPW) service via ePIXfab. The platform enables cost- effective R&D of silicon photonic ICs for high-performance optical transceivers (25Gb/s and beyond) and optical sensing and life science applications. The offered integrated components include low-loss waveguides, efficient grating couplers, high-speed silicon electro-optic modulators and high- speed germanium waveguide photo- detectors.
Since 2007, imec and its associated laboratory at Ghent University have been offering a platform for passive silicon photonic components via ePIXfab, for R&D under shared cost conditions. Now, imec extends its silicon photonics offering, using a standard130nm CMOS toolset, with active components such as high-speed optical modulators and integrated germanium photo- detectors.
“imec’s Silicon Photonics platform provides robust performance and solutions to integrated photonics products in medical diagnostics, telecom and datacom industries. Companies can benefit from our silicon photonics capability through established standard cells, or explore the functionality of their own designs in MPW,” stated Philippe Absil, program director at imec. “This Silicon Photonics MPW offer provides a cost- efficient solution, with state-of-the-art performance, design flexibility and superior CD and thickness control”. The first run opens for registration with tape-in on 9th of Oct 2013 and first devices will be out in May 2014. Support, registration and design kit access will be organized by Europractice IC service, in collaboration with world-wide MPW partners.
Issue I 2013
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