Metrology characterisation
so users don’t have to worry if their measurements are being compromised by noisy connections.
Q A
Temperature control at interconnect junctions is of concern for manufacturers of high end products. How does the new platform address the industry needs?
To minimize the unwanted effects of device self-heating during testing, the Model 2651A supports pulsed measurements. A single Model 2651A can pulse up to 50A; two units can be combined using the TSP-Link bus to pulse up to 100A.
It can capture transient behavior such as changing thermal effects with one-microsecond per point (1MHz) sampling. The width of a sourced pulse can be programmed from 100 microseconds to DC and duty cycles from 1 percent to 100 percent are also programmable. The Model 2651A provides a digitizing
measurement mode that uses 18-bit A/Ds for characterizing transient behavior precisely. A separate integrating measurement mode, based on 22-bit A/Ds, provides the maximum measurement accuracy and repeatability. For applications like studying the thermal impedance of power diodes and LEDs, characterizing the slope of the measured voltage at the top of the pulse is important. This capability is also useful for characterizing pulse amplitude flatness. The Model 2651A’s high speed A/Ds simplify digitizing the top of the pulse accurately when the measurements are made synchronously with the source.
Q A
What are the key areas of power semiconductors that this platform addresses?
Perhaps the most significant area is the
enhanced efficiency of new materials and the testing challenges that come along with that greater efficiency. “More efficient” means that when the semiconductor is “on,” it’s really on and when it’s “off,” it’s really off. Because it is designed to source and
measure pulses of up to 50A (or 100A if two are connected together) and measure voltages down to a microvolt, the Model 2651A offers the developers of new materials the ability to characterize the resistance from drain to source
when the device is on (RDSon) with high accuracy. At the same time, manufacturers of these new materials are striving to minimize leakage current from drain to source when the device is “off”(IDSoff); with its one-picoamp current measurement resolution, the Model 2651A makes it possible to characterize this parameter with high confidence.
Q A Keithley has a long history of test and
measurement in the semiconductor and related industries. What are the key issues that Keithley sees facing the industry over the next few years as advanced and multiple device requirements are needed to meet roadmap intentions?
Obviously, the demand for higher efficiency
devices won’t be going away. That means that not only will current manufacturers be experimenting with new materials but new companies will enter this segment of the market. Typically, when that happens, to meet the new manpower demands, less experienced people are going to be chasing more complicated technologies.
That obliges Keithley and other test vendors
to keep producing products that are as simple as possible to use, so someone doesn’t have be a test expert to start using them effectively. It also means we have to stay on top of providing applications support to get these new users up to speed quickly so they can find the products they need to do their jobs more efficiently. High accuracy products alone aren’t enough—we have to continue making those products easy for our customers to use.
© 2011 Angel Business Communications. Permission required.
MARK A. CEJER is a marketing director for Keithley Instruments, Inc., Cleveland, Ohio, which is part of the Tektronix test and measurement portfolio. He joined Keithley in 1991. During his tenure, he has served in a variety of positions, including marketing engineer, product/marketing manager, regional sales manager, and business manager. In his work, he has helped define and launch a number of Keithley’s most popular instruments, including many of the company’s SourceMeter instruments, digital multimeters (DMMs), and datalogging products.He holds a BSEE from the University of Akron (Akron, Ohio) and an MBA from Case Western Reserve University (Cleveland, Ohio.)
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