Cover Story
Living in a material world
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Manufacturers face a dilemma with the key to future technology laying with materials and their reticence to introduce new materials into their processes. Dr. Geoff Irvine, Vice President, Marketing and Business Development and Xiaohong Chen, Market Manager, SAFC Hitech discuss the importance of partnerships to realise the material possibilities whilst reducing interruption.
saw positive signs of recovery in the semiconductor market, a trend which has continued in 2011. Materials continue to play a pivotal role in enabling advances in the global microelectronics and technology markets, not only in the silicon semiconductor space, but also in compound semiconductors and rapidly growing adjacent markets, including PV, solar and HBLEDs. According to Linx Consulting{i} , between 2001 and 2010, the semiconductor materials market more than doubled in size, experiencing strong growth from $20.3 billion to $43 billion, with a CAGR of around 6.5%. The market demand for higher density memory devices has driven a critical need for new materials to enable the continued development of disruptive and novel chip processing technologies and manufacturing processes. This explosion of growth over the last decade mirrors the change in device scaling from geometrical scaling, which was ‘de rigueur’ in the three decades leading up to 2000, to the new era of equivalent scaling, expected to remain intact until at least 2014. During the past decade, the materials revolution enabled new processes and device structures that facilitated the continuation of Moore’s Law which, in turn, saw the semiconductor industry see substantial growth, from approximately $200bn in 2000 to $304bn in 2010, according to KPMG. We saw a rapid expansion of new materials from the periodic table enabling innovations at the BEOL and FEOL, significant scaling of memory devices and the introduction of new type of semiconductor devices, such as non-volatile memory.
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Partners in a material world In this highly competitive market, the acceptance of new materials and the adoption of new deposition and delivery
ollowing the challenging economic landscape in 2008 and 2009, 2010
www.euroasiasemiconductor.com Issue IV 2011
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