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38


nanotimes


Companies Facts


tributor in Singapore, Malaysia, Indonesia, Thailand, Philippines and Vietnam.


http://www.nanoink.net http://www.scitech.com.au


N


anoLogix (OTC: NNLX), an innovator in the accelerated detection and identification of


microorganisms, will move its research and develop- ment operations from Cincinnati to its headquarters in Hubbard, Ohio, USA. The company is converting a portion of its headquarters facility into a laboratory to house R&D operations.


http://www.nanologix.com N N


anoMas Technologies, Inc., will be making available improved formulations of their


NanoSilver and NanoGold-based inkjet inks at the end of July 2011. The new formations will feature increased solids loading, improved jettability and increased shelf life.


http://www.nanomastech.com


anometrics Incorporated (NASDAQ: NANO) announced that Samsung Electronics Co. Ltd.


has accepted its UniFire 7900 metrology system for process control of advanced wafer scale packaging. The metrology tool successfully completed evaluation for development of through-silicon via (TSV) techno- logy, projected to be a key enabling feature of next generation semiconductor device designs. Nano-


N


ano-Nouvelle has secured $1.1m in new investment led by Adelaide-based Terra Ros-


sa Capital to fund the next stage of its cutting edge research. Nano-Nouvelle aims to capture a signifi- cant slice of the booming sustainable energy markets using a patented approach and thin film technology to convert various forms of energy into electricity.


http://www.innovation-centre.com.au


metrics’ UniFire system has now been adopted by five of the top seven semiconductor manufacturers worldwide for wafer scale packaging for advanced TSV and micro bump process control. The UniFire tool offers customers a broad range of features to control micro bumps, redistribution layer(s) and TSV patterning, etch and deposition processes, including measurement of critical dimensions (CD), registrati- on and depth/height/profile, as well as the ability to measure wafer bow/shape and film thickness.


“High precision measurements of TSV, micro bump, and redistribution processes are critical to enable high-yield DRAM devices for next generation wafer scale packaging,” said Kevin Heidrich, Vice President of Marketing and Business Development at Nanome- trics. “The UniFire offers a unique, non-destructive, 3-D metrology capability allowing full surface topo- graphy control while reducing the need for multiple, independent metrology tools. This capability makes it an indispensable tool to ensure a higher yielding, quality manufacturing process with reduced cost of ownership.”


http://www.nanometrics.com


11-08 :: August 2011


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