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ASM release innovative
3D experts combine efforts -
epitaxial process -
28 Jan, 2010
28 Jan, 2010
Leti and R3Logic to combine expertise In technology research infrastructure, we have
ASM releases new epitaxial technology for 3D integration and packaging. the full range of competencies of the ideal
power devices with Fairchild first to qualify. ecosystem working together,” said Laurent
Leti and R3Logic, a leading 3D IC EDA Malier, CEO of Leti.
ASM International has introduced its company, have announced that they will
PowerFill epitaxial silicon (Epi Si) trench fill combine their expertise in 3D silicon “We are confident this joint lab will
process. The new process enables void free integration and packaging. accelerate the adoption of 3D-IC
filling of deep trenches with doped, epitaxial technologies by the semiconductor industry,
silicon. PowerFill is an enabling process Under the terms of the common laboratory which will better align its fabrication
technology as it is about 3 times faster than agreement, they will use new generation process, and by the mobile- and consumer-
competing processes, reducing EDA tools provided by R3Logic to build 3D device industries, which will develop more-
manufacturing costs and creating an IC designs and methodologies for consumer competitive products.”
additional degree of freedom in power and wireless applications.
device design. “Being closer to world-leading design
3D ICs enable dramatically improved and technology teams will allow us to
Fairchild Semiconductor is the first performances at a much lower cost than accelerate the adoption of our EDA tools,”
customer to qualify the process for its new, leading-edge CMOS technologies. The said Lisa McIlrath, CEO of R3Logic,
advanced power management devices, creation of these new ICs depends on the which opened an R&D center in Grenoble
having completed verification at its fab in availability of new methodologies and skills in 2009.
Korea. For this application, ASM’s that require a deep understanding of the
PowerFill process enables power overall semiconductor supply chain, “We are collaborating with Leti for three
management devices and circuits to be including EDA, design technology and reasons: their research and technology
realized in a smaller footprint thereby fabrication technology. expertise will help us accelerate
reducing die cost and form factor. development of our tools, their business
This three-year Leti-R3Logic common lab is model allows us to better protect our IP,
“Requirements on discrete power aimed at developing 3D-design solutions to and finally, their immersion in a complete
MOSFETs are demanding lower on- accelerate developments in 3D chip- ecosystem that concentrates in the same
resistance, lower gate charge and higher package co-design, including TSV region the full spectrum from R&D in
current capability,” said C.B. Son, placement and short-loop floor planning, advanced concepts to major global
Fairchild’s Director of Process Technology. allowing management of all aspects of the providers of mobile and consumer
“The Epsilon tool’s performance with design flow in an integrated fashion. applications.”
PowerFill has been impressive and was a
significant enabling factor as we have “With R3Logic’s presence in Grenoble
worked to integrate this advanced trench and Leti’s leading design-and-process-
Epprocess, allowing us to realize
considerable cost savings as a result of its
significant improvement in process
throughput.” Sensor Electronic Technology, Inc. Attains
Compared to alternative processes that
ISO9001:2008 Certification - 28 Jan, 2010
require multiple passes through an epitaxy
reactor to realize a similar device structure, Sensor Electronic Technology, Inc. (SETI), built over the past 5-years of commercially
the innovative trench fill technique world leaders in deep UV LEDs announces supplying our deep UV LED products”
developed in the ASM Epsilon system it has gained and is operating in full said Dr. Remis Gaska, President and CEO
enables a void free Epi process in a single compliance with the International Quality of SETI.
deposition step. The single step process is System Standard ISO9001:2008 as of
able to triple the throughput for the epitaxial December 13th, 2009. SETI is the world’s only commercial
Si process, while maintaining void free filling supplier of deep UV LEDs and LED
characteristics, good uniformity and high By meeting this standard SETI has once products and offers a catalogue of
yield. again established a position of industry wavelengths from 240 nm to 400nm at
leadership. This important milestone is powers from 0.3 mW to 50mW.
“The development of this high-speed trench testament to SETI’s commitment to
fill process is yet another example of how quality excellence that is consistent in SETI offers a full portfolio of standard LED
ASM works with its customers to enable exceeding customer expectations. and LED Lamps as well as custom-
advanced materials and epitaxy processes designed devices and systems into markets
in high-volume manufacturing,” said “The ISO9001:2008 certification including analytical instrumentation, optical
Shawn Thomas, Director of Epi Technology validates our commitment to quality and the sensors, process control, medical systems,
at ASM. exceptional customer service that we have water and air purification and many others.
10
www.compoundsemiconductor.net January/February 2010
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