technology laser manufacturing
rhombus4
Bandwidth demand continues to grow exponentially, with steadily reducing
revenue per bit . Key attributes of the emerging infrastructure include:
packet friendly common infrastructure; converged voice, data & video;
zero touch service provision; lower operating costs; node consolidation;
scalable service speeds; scalable service level agreements; and increased capacity
very attractive as an integration platform and for PICs. The consolidation; scalable service speeds; scalable service
process complexity of the GaAs based lasers is relatively level agreements; and increased capacity.
low compared to that for the InP based devices and
circuits, so the article here will focus on the latter, Taking all these together we see a trend to the
particularly with reference to the more complex integrated implementation of an intelligent photonic core, with a
devices that are manufactured. reconfigurable optical add-drop multiplexer (ROADM)
interconnected mesh topology; full band tunability is
Needs and Differentiators... critical, with primary capacity per wavelength increasing
Critical to unlocking the value of fab ownership is from 10 to 40 and 100Gbps. More complex modulation
deciding what the device and circuit demand might be. formats, including RZ-DQPSK at 40Gbps and coherent
Our transmission business primarily concentrates on the PM-QPSK for 100Gbps are increasingly required to allow
DWDM space, for long haul and Metro applications. for upgrades to existing 10Gbps routes using installed
fibre plant and to cost reduce new build by transferring
Bandwidth demand continues to grow exponentially, with dispersion management from the optical domain into the
steadily reducing revenue per bit. Key attributes of the electronic using DSP and coherent detection.
emerging infrastructure include: packet friendly common
infrastructure; converged voice, data & video; zero touch For all these requirements, photonic integration is a key
service provision; lower operating costs; node enabling technology for cost and footprint reduction. The
challenge is to ‘print’ the complexity through photonic
integration and achieve the scalability through batch
processing of wafers. Moving further towards the edges
of the network, low cost provisioning of 10G DWDM
tunable links in as small a form factor as possible – XFP,
SFP+ and pluggable multichannel will be increasingly
important. Again, photonic integration is a critical enabler
here, backed up by other assembly technolgies..
As access and backhaul demands rise, enhanced passive
optical network (PON) technologies will be required,
which may see demand for low cost tunable lasers rise to
commodity levels; we are already studying the
implications and network requirements for this. Opening
up such applications would require a very low cost
tunable device, suitable for deployment in a ‘colorless’
optical network unit (ONU). Part of such a strategy would
demand minimal testing – which is a significant cost driver
when devices must be calibrated and guaranteed for
frequency stability to Telcordia requirements. Such an
application would drive extremely high volume, in the
Automated on millions per year.
wafer testing of
ILMZ chips for InP-based photonic integration must enable both speed
Tunable XFP enhancements and cost reduction, whist retaining full band
36 www.compoundsemiconductor.net January/February 2010
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