Contents Regulars


04 Technology 08 Focus 14 Column: Embedded design 16 Column: Silicon systems design


20 Column: Design with frequency components


46 Supplier’s guide / Web locator


COVER SUPPLIED BY ROCHESTER ELECTRONICS


MORE ON PAGES 6-7 Features


24 Design of a microstrip bandpass fi lter with open-loop resonator for sub-6GHz 5G applications


By Georges Zakka El Nashef from the College of Engineering and Technology at the American University of the Middle East, Kuwait, Ahmet Halit Coşkun of İmaj Otomasyon, İstanbul, Turkey, and Şehabeddin Taha İmeci, also of the American University of the Middle East in Kuwait


30 From AVR to ARM: Engineering smarter systems with Arduino UNO R4 By Dr Dogan Ibrahim, Electronics Engineering Consultant, and Sami Spiteri, student at the Harris Academy, Greenwich, UK


36 Enabling a critical phase in SoC development By Romain Petit, Product Manager for Software Prototyping solutions, Siemens EDA


44 New developments in multi parametric sensor systems By Craige Palmer, Sales Director, Hamamatsu Photonics UK


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38 Meeting modern embedded design challenges head-on By Jonathan Hacker, Chief Technology Offi cer, TeleCANesis


www.electronicsworld.co.uk December 2025/January 2026 03


40 Achieving sustainability goals through test and measurement


By Michael Rietvelt, Power and Energy Measurement Specialist at Yokogawa Test & Measurement


42 Regulatory compliance of IoT devices with pre-certifi ed radio modules By Phil Evans, Business Development Director – Connectivity (Northern Europe), TÜV SÜD


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December 2025 / January 2026 Volume 131 Issue 2052 £5.90


More on pages 6-7


IN THIS ISSUE: • Communications • Embedded design • T&M


• Sensors


Regular columns: • Embedded design


• Design with frequency components • Silicon systems design


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