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CCD sensor and special sockets E-tec design and manufacture a wide range of high


Advanced Interconnections low stack height Mezza-pede®


SMT Connector


Advanced Interconnections’ newest Mezza-pede®


SMT Connector, low


profile model DHAL, reduces board stack height by 15%. When paired with the mating socket, a z-axis stack height of 0.132 in. (3.4mm) is achievable – providing a reduction in package height and a shorter signal path in datacom and networking applications.


Advanced Interconnections Corporation USA Tel: 1 (401) 823-5200 Email: info@advanced.com www.advanced.com


Application of SC series KEMET chokes working at


high temperatures in the automotive industry A growing number of car manufacturers are deciding to utilise high-voltage equipment with a view to enhancing the comfort of driving or general vehicle users’ experience. However, it is connected with a higher demand for additional electric power supply. This problem is not going to be solved by adding new energy sources - which results in increasing vehicle weight and dimensions - but by a more effective use of the existing solutions.


This is why EPC (Electronic Power Control) systems used as performance adjusters have become more common. These systems are exposed to EMI regulations of OEM car manufacturer to not interfere with other devices in the vehicle. Therefore, chokes are used to reduce these interferences and attenuate the noise generated by the device. Material capabilities are key to comply with EMI regulations and given space and weight targets, research and development is meanwhile underway to produce the core material, whose aim is to produce smaller, cheaper and, most importantly, more efficient products.


The result of these efforts is the 7HT material used in KEMET chokes in the SC series and other customized products. Compared with the previous 5HT material this ensures 40% better noise attenuation with the same equipment parameters - in particular its size. Depending on clients’ requirements, KEMET is able to the right magnetic solution for individual project needs. This level of performance is retained even at 150°C, which makes it a perfect solution that can be installed close to vehicle engines and within high power and drive train DC/DC converter


tme.eu Cadence® Spectre®


Cadence Spectre X Simulator is a massively parallel circuit simulator designed to provide 3X to 10X performance gains, while maintaining the golden accuracy customers have come to expect from 25 years of Spectre industry leadership in analog, mixed-signal and RF applications. The new Spectre X simulator can solve 5X larger designs when compared to previous Cadence simulation solutions, enabling customers to effectively simulate circuits containing


millions of transistors and billions of parasitics in a post-layout verification flow.


The Spectre X Simulator was developed to handle the electrical verification of large-scale analog-centric SoC designs (e.g., high-speed SerDes), 5G RFIC designs, and advanced-node IP blocks. It is the perfect solution for a designer who needs analog-type accuracy for designs that require millions of calculations for each time step. The Spectre X Simulator takes advantage of the cloud infrastructure to perform massively distributed simulations required to verify complex full-chip designs in a timely manner.


For more information on the new Spectre X Simulator, please visit: www.cadence.com/go/SpectreX


X Simulator - Solving large-scale verification simulation challenges


quality sockets for CCD-CMOS image sensor and customer specific applications. Various socket terminations allow E-tec to offer a socket with mounting options including through hole, smt and solder ball.


Footprints are created to match the sensor or package, so footprints can be created for a range of pitches including multipitch without any additional set up costs.


Pitches include 0.4mm, 0.50mm, 0.65mm, 0.75mm, 0.80mm, 1.27mm, 1.50mm, 2.00mm, 2.20mm, 2.54mm, 3.00mm etc. Insulators are typically produced in FR4 epoxy or similar hi temperature material.


Many other custom sockets and adaptors can be produced for example relay sockets, fuse sockets, and chip adaptors where problems caused by chip obsolesce can be avoided by reconfiguring the chip footprint using an E-tec adaptor.


Customers are invited to email mechanical details of the component they wish to socket or adapt and E-tec will respond promptly with a proposal.


E-tec Interconnect (UK) Ltd Tel: 01892 530260 info@e-tec.co.uk www.e-tec.co.uk


Hitaltech launches new rigid Conex-it range at


Engineering Design Show 2019 16-17 October 2019 - Stand L48, Ericsson Exhibition Hall, Ricoh Arena, Coventry


• Hitaltech’s new Conex-it rigid interconnect range introduces tens of thousands of connection permutations available off the shelf.


• The rigid range complements the specialist applications of Hitaltech flexible interconnect products.


• The new range makes production leaner and simpler, with rigid and flexible connectors available from a single source.


• The new range comes with the quality, availability and speed of delivery manufacturers have come to expect from Hitaltech.


• Custom pin lengths are available for any application.


• The new range will launch at the Engineering Design Show, the UK’s only event entirely dedicated to engineering, electronics and embedded design.


For more than 30 years, Hitaltech, the connecting technologies and enclosures specialist, has been the electronics manufacturing industry’s trusted source for flexible interconnect products, terminal blocks and enclosures.


Now, Hitaltech is expanding its Conex-it range to include a whole new range of rigid interconnect products, delivering even greater choice whilst maintaining the quality, availability and speed of delivery manufacturers traditionally associate with Hitaltech.


hitaltech.co.uk


19" insert modules with variable dimensions Not all PCBs and electronic devices fit into the specified standard sizes of a 19” cassette. For this


purpose Fischer Elektronik offers a 19” cassette with variable dimensions. With the new cassette type G any standard and customer specific size can be realised. This is made possible by four edge profiles with integrated grooves for the insertion of side plates as well as top and bottom panels. T-grooves for threaded inserts, slide nuts or screw heads allow a simple mounting of the electronics. External screw channels for the mounting of front and back panels prevent short circuits caused by possible falling out screw chips.


The standard seizes of the cassette type G amount to 3U height, an insertion depth for Europe cards with the sizes 160mm or 220mm as well as five different widths (10, 12, 14, 16 and 20 HP). The different back panel cuts from the standard portfolio as well as customised cuts allow different functions of the cassette. For a better ventilation of the electronics Fischer Elektronik offers the optionally perforated cover panel. An easy removal and insertion of the cassette of the 19” subrack is


realised by optional handles made of plastics or aluminium. The cassette type G is offered with three different surface treatments: natural colour anodised (ME), black anodized (SA) or electrical conductive transparent passivated (TP). As Fischer Electronic offers its customers greatest possible flexibility for the products further surface treatments, printings or additional mechanical treatments according to customers specifications are naturally possible.Further modifications and special designs are realised according to customer specifications. Please contact us, for further information and inquiries the product experts of Fischer Elektronik are pleased to be at your disposal, also at:


www.fischerelektronik.de


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