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New Lattice CrossLinkPlus FPGAs accelerate and enhance video bridging for world-class MIPI-based
embedded vision systems CrossLinkPlus family combines FPGA flexibility with instant-on panel display performance, accelerating designs in industrial, automotive, computing, and consumer applications
Lattice Semiconductor (NASDAQ: LSCC), the low power programmable leader, today introduced the CrossLinkPlus™ FPGA family for MIPI D-PHY based embedded vision systems. CrossLinkPlus devices are innovative, low power FPGAs featuring integrated flash memory, a hardened MIPI D-PHY and high- speed I/Os for instant-on panel display performance, and flexible on-device programming capabilities. Additionally, Lattice provides ready-to-use IPs and reference designs to accelerate implementation of enhanced sensor and display bridging, aggregation, and splitting functionality, a common requirement for industrial, automotive, computing, and consumer applications.
Developers want to enhance the user experience by adding multiple image sensors and/or displays to embedded vision systems, while also meeting system cost and power budgets. Lattice addresses this need with CrossLinkPlus FPGAs: small (3.5 x 3.5 mm), low power (< 300 µW) devices specifically optimised for embedded vision applications with features like a hardened MIPI D-PHY, broad high-speed I/O support for interfaces like OpenLDI and RGB, and on-chip non-volatile flash memory. CrossLinkPlus utilises its on- chip flash to support instant-on (minimizing visual artifacts that detract from the user experience) and flexible device reprogramming in the field.
www.latticesemi.com Nexperia secures $1,500M financing to
fund future growth plans Leading discrete semiconductor company’s refinancing fully supported
Nexperia, the expert in discrete and MOSFET components and analog & logic ICs, today announced the successful raise of USD 1,500 million equivalent of senior credit facilities. The proceeds will be used to refinance the existing outstanding debt and to partly finance the acquisition by Wingtech Technologies Co., Ltd., a listed Chinese computer and telecom equipment manufacturer.
The facilities were arranged and underwritten by ABN AMRO, Bank of America Merrill Lynch and HSBC acting as Global Coordinators and were syndicated to a group of twelve global banks in total. The refinancing is fully supported by Wingtech and provides a flexible financing package at very attractive terms to support the further growth of Nexperia going forward.
Nexperia is a Netherlands-headquartered, global manufacturer of discrete semiconductor components.
As a result of the Wingtech acquisition, the company is expected to capture long-term growth trends in China, further enhancing its revenues.
www.nexperia.com Power Integrations delivers one-millionth
GaN-based InnoSwitch3 IC Partners with Anker Innovations to drive GaN revolution in mass-market AC-DC power adapters
Power Integrations (Nasdaq: POWI), the leader in high-voltage integrated circuits for energy-efficient power conversion, today announced the delivery of its one-millionth InnoSwitch™3 switcher IC featuring the company’s PowiGaN™ gallium-nitride technology. In an event at the Shenzhen headquarters of Anker Innovations, Power Integrations CEO Balu Balakrishnan presented the one-millionth GaN-based IC to Anker CEO Steven Yang. Anker is a leading manufacturer of chargers and adapters, supplying retailers worldwide with powerful, compact USB PD adapters and a wide range of chargers and adapters for laptops, smart mobile devices, set-top boxes, displays, appliances, networking gear and gaming products.
InnoSwitch3 offline CV/CC flyback switcher ICs with PowiGaN technology are up to 95% efficient across the load range. Very low switching and conduction losses of PowiGaN primary switch allows delivery of as much as 100 W from a space saving InSOP 24D surface mount package in enclosed adapter applications without requiring a heatsink. Quasi-resonant InnoSwitch3-CP, InnoSwitch3-EP and InnoSwitch3-Pro ICs combine the primary power switch, primary and secondary control with safety isolated high speed link (FluxLink™) in between, as well as the secondary SR driver and feedback circuits in a single surface- mounted package. The superior switching performance of PowiGaN technology results in substantially higher efficiency, enabling very compact adapter designs.
www.power.com
Danisense invests in HV current transducer calibration lab
Certificate of Calibration assures customers of accuracy of instrument
Key points: • Free DC testing on all 5000V and 10,000V units
• Certificate of Calibration for each HV unit shipped
• Danisense current transducers offer high accuracy, high stability &affordability
Danisense, the leader in high-accuracy current transducers for demanding applications, has set up a DC calibration
test lab at its Danish headquarters and manufacturing site in Taastrup, further strengthening the company’s reputation for flexibility, quality and accuracy of its products.
A free service for its high voltage 500V and 10,000V products, units are 100% tested and shipped with a Certificate of Calibration which details the actual current error (always significantly less than the ppm values specified in the datasheet), the error without offset and the linearity error. This enables customers to have full confidence in the measurements they make.
www.danisense.com Panasonic Industry Europe supported TUM Hyperloop
team wins fourth SpaceX Hyperloop Competition 463 km/h for the win – Students of the Technical University of Munich win the SpaceX Hyperloop Competition again – supported by Panasonic Industry Europe components
On the 21nd of July the fourth SpaceX Hyperloop Pod Competition took place in Los Angeles. The Hyperloop concept was introduced in 2013 by SpaceX founder Elon Musk to challenge modern ways of transportation by racing extremely fast pods through a vacuum tunnel.
Since 2015, all three Hyperloop Pod competitions had been won by the student teams of the Technical University of Munich.
With its strong expertise Panasonic Industry Europe supports the TUM Hyperloop project with components and know-how. The students use components like the EX-L221 laser sensors that constantly measure the position of the pod inside the tube. The robust and very precise sensors are a perfect fit for this demanding challenge, since they can withstand the 10g of deceleration the pod generates when braking.
Each student team from around the world developed a pod that has to accelerate to the highest speed possible and decelerate to a complete stop. Within the evacuated, about one-mile long tube the pod is guided on an aluminum rail.
The TUM Hyperloop pod uses eight electric motors with a combined power of 320kW – which accelerate the carbon fiber chassis with up to 2g.
With a top speed of 463 km/h the TUM Hyperloop team had the fastest pod in the race and won the competition again – which adds up to a total of four consecutive wins for the students from the Technical University Munich. Panasonic Industry Europe is proud to support the innovative and successful students of the TUM Hyperloop project.
industry.panasonic.eu Mouser Electronics stocks Xilinx Zynq UltraScale+
Dual- and Quad-Core Multiprocessor SoCs Mouser Electronics, Inc., the industry’s leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, is now stocking Zynq®
UltraScale+ multiprocessor system-on-chips (MPSoCs) from Xilinx.
Xilinx Zynq UltraScale+ devices, available from Mouser Electronics, combine a high-performance Arm®
-based
multicore, multiprocessing system with ASIC-class programmable logic. The devices deliver maximum scalability, and can offload critical applications, such as graphics and video pipelining, to dedicated processing blocks. The MPSoCs also include a full complement of integrated peripherals and connectivity cores suitable for next-generation applications such as 5G wireless, automotive ADAS, and industrial Internet of Things (IoT).
The Zynq UltraScale+ family of MPSoCs comprises three distinct variants (CG, EG, and EV), each of which includes two or four Arm Cortex®
-A53 cores and two Arm Cortex-R5 real-time
processing units. The dual-core CG devices are optimal for industrial motor control and sensor fusion. Both the EG series and EV series devices feature four Cortex-A53 cores, as well as an Arm Mali-400 graphics processing unit. The EV series also includes a video codec unit that supports H.265 High Efficiency Video Coding (HEVC) and H.264 Advanced Video Coding (AVC) standards, making them ideal for multimedia, ADAS, and surveillance applications.
To learn more about the Xilinx Zynq UltraScale+ MPSoCs, visit:
www.mouser.com/xilinx-zynq-ultrascale-mpsoc
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