Embedded Technology
having a range of processors and wireless connectivity for different applications.
also be reduced by using OSM modules, as
modules can be used to begin development before hardware has been developed and prototyped.
However, the testing strategy is different because a standard product would use a single test or a few multiples of a test. Moving to OSM means having a range of processors on the range of modules, and this can increase the testing required for a particular product.
The solderable OSM, which is typically supplied on tape, allows more automated production, avoiding the need for a carrier
The impact of AI
Artificial intelligence (AI) is a strong trend in the data centre and is beginning to make its way as much into the industrial market. There are a few applications where AI makes a lot of sense, such as predictive maintenance and video, but in general a lot of people have not developed their AI strategy to the point where they have a concrete business case behind it. That’s a bit like the IoT discussion 15 years ago. Designers, however, need to explore this space and evaluate the different processors
board and speeding up project delivery times, but this introduces new considerations around test.
and accelerators, and modules are an easy way to add this capability to a design. This is driving interest in demonstrator kits for different applications, particularly video and computer vision applications.
The need for more communications capabilities Another strong trend is wireless. The emergence of 5G and a lot of the other wireless standards means much more bandwidth is now available, even in applications where people were a bit hesitant in the past, such as industrial automation, so wireless will get more prominent. It’s interesting that companies such as Qualcomm are entering the industrial market and they have a sweet spot in performance between the x86 and the existing ARM portfolio. Customers are excited about this,
An increasing focus on security Security has always been a key consideration for embedded systems development. The European Cybersecurity Resilience Act came into force in December 2024, however, and that will have a huge impact. Module makers will need to make sure that they comply with the regulations through 2025 for their customers.
Developing modules that meet the challenges
The increasing performance and complexity of processors that are being used in today’s embedded systems, and the compact size of OSM modules, means that developing modules presents many challenges. Suppliers with strong track records bring the experience that enable them to deliver a broad portfolio of reliable modules. It’s not just about providing great hardware: software and security support is key: you can’t just ship a module and forget about it. That support requirement will be considerably more important throughout 2025. Tria has a task force that looks at the regulations and makes sure that we create products along the lines of the legislation. We also have a strong software team that helps customers during the design process, with the software integration and across the project to make sure the design is compliant. Tria started module development and production many years ago with strong R&D and manufacturing in Germany. Now we’ve added teams in the Americas, Italy, and China, to create a global design network. We’ll also be adding additional R&D capabilities in 2025.
2025 will see considerable changes for the embedded market, but this is just the beginning. As the industrial market returns to growth there will be more and more innovation in the coming years. Smart development teams will partner with strong and experienced module suppliers such as Tria to enable them to meet the diverse challenges they face.
www.tria-technologies.com
www.cieonline.co.uk Components in Electronics March 2025 39
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