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sales@lineonesales.co.uk X-FAB announces full production release of new
High-Voltage Galvanic Isolation Technology X-FAB Silicon Foundries SE, the leading analog/mixed-signal and specialty foundry, has announced the full volume production release of its new high temperature galvanic isolation semiconductor process. This proprietary technology is fully automotive qualified, and offers greater reliability levels compared to options offered by the competition.
Galvanic isolation electrically separates circuits in order to improve noise immunity, remove ground loops, and increase common mode voltage. It can also protect human interfaces from contact with high voltages. An example where this plays an important role is the control of IGBT or SiC power modules in industrial and automotive environments. Further applications include data communication in field bus systems, battery management systems or the usage in medical equipment.
Key advantages of the new X-FAB galvanic isolation process include: • Operational temperatures of up to 175°C
• Successfully tested up to 6,000 Vrms @ 50Hz and 10,000 VDC • Uninterrupted barrier layer with 0 ppm residual contamination
• Demonstrated conformance with latest IEC 60747-17 semiconductor coupler draft standard • Support for working voltages up to 1.7 kV
X-FAB offers two types of packaged galvanic isolation devices for customer evaluation. The capacitive coupler test chip, G3-C1, has an isolation layer thickness of 11 µm and was tested to withstand up to 6,000 Vrms (the maximum limit of the test setup). An inductive coupler test chip, G3-T06, is also available for customer evaluation and has an isolation layer thickness of 14 µm.
X-FAB Silicon Foundries Tel: +49 361 427 6170
www.xfab.com
Georg Steinberger joins IDEA leadership team
The International Distribution of Electronics Association, an international federation of the local country electronic components industry associations is delighted to announce the appointment of Georg Steinberger, Chairman of the board of the FBDi association, as its new President, effective immediately. Silvio Baronchelli, who served as President of IDEA for 35 years has accepted the role of Honorary President.
“It is a great honour to work with IDEA on the global promotion of the electronics components industry”, said Georg Steinberger on his appointment. “Distribution and its services and solutions are key to the global supply chain and product life cycle of all customers, and it is necessary to underscore our performance for the industry. While the local country associations do an excellent job on collecting market
data and collaborating on political, legal, commercial and environmental industry topics, IDEA is the ideal vehicle to surface trends and developments for an international audience.”
https://ideaelectronics.com/ New warp and edge blend chips
Omnitek recently shipped the first of its Flex SoCs, a family of silicon devices designed for video warping in the small projector and digital signage markets.
Two family members are available, Flex 2K (2048 x 1200 pixels) and Flex 4K (4096 x 2400 pixels), both at up to 60fps. Both perform a comprehensive set of
image geometry correction functions on a video stream, including rectilinear or arbitrary image warps and full 360-degree rotation, as well as edge blending. This makes them ideal for projector image correction and projection of a single large image from multiple projectors. Additionally, they can be used for camera lens correction, such as fish-eye lens distortion. The real-time response of the Flex devices extends their suitability to VR and AR applications.
These fixed-function parts are supported by evaluation boards, reference software and datasheets.
Omnitek also offers customisation services for those with specific design requirements.
www.Omnitek.tv/flex_2k www.Omnitek.tv/flex_4k
Industry’s first end-to-end LoRa®
The Things Industries As the LoRa®
ecosystem accelerates, security remains an area for improvement in the market due to vulnerabilities that leave the network and application server keys accessible in the memory of modules and microcontrollers (MCUs) paired with a LoRaWAN™ stack. If keys are accessed in a LoRaWAN device, a hacker can impersonate it and authorise fraudulent transactions, which can result in a scalable attack with substantial losses in service revenue, recovery costs and brand equity. Microchip Technology
Inc. in partnership with The Things Industries, today announced the industry’s first end-to-end security solution that adds secure, trusted and managed authentication to LoRaWAN devices at a global scale. The solution brings hardware-based security to the LoRa ecosystem, combining the MCU- and radio-agnostic ATECC608A-MAHTN-T CryptoAuthentication device with The Things Industries’ managed join servers and Microchip’s secure provisioning service.
www.microchip.com Omron compact PMS aid automation in
industrial and office systems Omron Electronics Components Europe is addressing the growing demand for contactless position and presence detection in industrial machinery, office automation and similar applications with the launch of a new range of exceptionally compact surface mount photo-microsensors.
The new Omron EE-SX3173 and EE-SX4173 are just 13.6 x 14.7 x 8.3mm making them one of the most compact solutions for this application on the market. The devices feature a 5mm slot width and are offered with 5V or 24V DC drive. The 5V DC version is designed for consumer electronics and office equipment. The 24V DC version offers easier integration into heavy duty industrial systems. Both are offered in either dark-ON or light-ON configuration to simplify circuit design. Initially released as board-mount SMD devices, Omron is expecting to release wire- mount connector versions in the near future.
security solution
provides secure key provisioning with Microchip and (Long Range) technology
Omron supports contactless position and presence detection with new, exceptionally compact surface mount photo-microsensors
Commenting, Gabriele Fulco, Product Manager Sensors of Omron Electronics Components Europe said, “Demand for sensors is increasing in a context where industrial and office equipment alike features ever higher levels of automation and functionality. Omron has responded with the launch of a very competitive range of photo-microsensors, offering exceptional performance and ease of integration for non-contact presence detection, position detection or motor rotation measurement.”
The EE-SX3173 and EE-SX4173 are securely attached to the PCB using M3 screws. A Zener diode is optionally available to enhance noise immunity. The connectors to the devices are held in place with secure locks to help prevent disengagement during high levels of vibration.
http://components.omron.eu
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