INTERCONNECTION
Mencom introduces ILME “21.21” metal hoods with M25 angled entry
The wide range of 21.21 rectangular connectors offers a number of advantages for modern industrial applications. They provide a secure and reliable connection for power and signal transmission, with high resistance to environmental factors such as dust, moisture, and vibration.
I
n addition, their compact design allows for easy installation and maintenance, making them a popular choice for a wide range of industrial machinery and equipment. The new size 21.21 metal hood with angled M25 cable entry can accommodate large diameter cables or wire bundles while eliminating torsional stress on the locking lever of the mating enclosure. They are available in four different versions: a standard version for heavy-duty applications, a DESINA version with a bonded
gasket, a W-type version with improved corrosion resistance for aggressive environments, and an EMC version with a conductive surface for optimum electromagnetic shielding.
These are fully compatible with the existing range of “21.21” enclosures and they are particularly suitable for CQ series inserts with a high number of individual conductors. When installed with the sealing kit (CKR-65 or CKR-65D), they provide IP66/67/69 degrees of protection.
Smiths Interconnect announces breakthrough contact technology of Kepler test socket
Smiths Interconnect has announced the launch of Kepler contact technology for IC Testing. Whether for testing high performance computing, wearables or other automotive chips, Kepler is the only solution that provides two-axis of motion during a single actuation of the socket, an innovation set to pioneer the semiconductor test industry.
A
pass yield, enhanced production reliability, and extended maintenance intervals. The semiconductor test industry has traditionally used vertical spring probes for BGA, LGA, QFN, and QFP packaging testing, while the cantilever scrubbing contact design has been used in peripheral segments to remove surface oxides and contaminants. However, both technologies require maintenance and performance monitoring to ensure optimal results during testing cycles. To address these issues, Smiths Interconnect developed Kepler contact technology that combines the scrub motion of a cantilever probe.
The design includes horizontal movement during the downward stroke of the device to break surface oxides, provide stable and reliable contact, and cause no damage to the PCB.
22 JULY/AUGUST 2023 | ELECTRONICS FOR ENGINEERS
Brian Mitchell, vice president and general manager for Smiths Interconnect semiconductor business unit, said: “The continuing advances in semiconductor functionality, density, and chip-level integration are generating new challenges in testing and controlling the physical and electrical characteristics of the test contact interfaces. “The piercing effect of spring probes on gold pads has been a challenge due to the buildup of surface oxides. Additionally, the cantilever type has been associated with expensive PCB damage. Kepler overcomes the challenges posed by traditional vertical spring probes and cantilever scrubbing contact designs, providing a new level of performance and reliability.”
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40 |
Page 41 |
Page 42 |
Page 43 |
Page 44 |
Page 45 |
Page 46 |
Page 47 |
Page 48 |
Page 49 |
Page 50 |
Page 51 |
Page 52 |
Page 53 |
Page 54 |
Page 55 |
Page 56 |
Page 57 |
Page 58 |
Page 59 |
Page 60 |
Page 61 |
Page 62 |
Page 63 |
Page 64 |
Page 65 |
Page 66 |
Page 67 |
Page 68 |
Page 69 |
Page 70 |
Page 71 |
Page 72 |
Page 73 |
Page 74
