TECHNOLOGY IN ACTION ADVERTORIAL


IBASE Launch New IoT Gateway Systems with TPM Security I


BASE Technology, a manufacturer of application specific industrial embedded computing platforms, is pleased to announce the release


of its AGS100T/AGS102T IoT gateway systems. Powered by Intel’s Apollo Lake Atom™ x7/x5 series, Pentium® N4200, and Celeron® N3350 SoCs, the systems enable seamless and secure data flow to the cloud in IoT-focused applications with enterprise-grade security, and easy manageability. The AGS100T/AGS102T compact fanless platforms offer


German Component Distribution records weak order situation


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urnover of German Component Distribution (according FBDi association) decreased by 2% in 2nd quarter 2019.


Order situation remains poor. For the first time after two years the decreasing order


situation in the German component distribution results in a slight drop in turnover. Sales of distribution companies under the umbrella of the Fachverband Bauelemente- Distribution (FBDi e.V.) dropped by 2% to 879 Million Euro. Orders further weakened to around 748 Million Euro, equating to a book-to-bill ratio of 0.85. Regarding the major product segments, semiconductors


and passive components remained at the previous year's level (623 Million Euro or 112 Million Euro), electromechanics dropped by 12% to 91 Million Euro, power supplies dropped by 7% to 26 Million Euro. The smaller product segments (displays, assemblies and devices) also declined, only sensors grew by 22%. The market share has scarcely changed: semiconductors held a 70% share, passive components 13%, electromechanics 11%, all other segments combined to 6%.


FBDI u www.fbdi.de


maximum reliability and longevity support, featuring wide-range operating temperature of up to -40°C ~ 70°C and dimensions of 160 x 110 x 44mm. Both models are suitable for space-constrained applications in harsh environments that require devices equipped with Trusted Platform Module (TPM) technology. The rugged AGS100T features 4GB DDR3L-1866 DO-DIMM, a 64GB MLC industrial-grade mSATA SSD, dual display


ports (DVI-I and DisplayPort), 4x USB 3.0, 2x GbE, 2x COM, a DC-in terminal block for 9V~36V input and over/under/reverse voltage protection.


IBASE Technology u 01438 846 090 u www.ibase-europe.com


Accelerate Autonomous System Development with RTI Connext DDS W


ith RTI Connext DDS, Real-Time Innovations provides the only standard-based framework to support autonomous vehicle


development from research to production. RTI Connext DDS can meet the latency, throughput and scalability requirements of even the most demanding use cases, using extensive QoS parameters, peer-to-peer connectivity, and efficient handling of large data. With no need for servers and brokers, and through its flexible, extensible data model, it easily scales according to task. To meet certification requirements for ISO 26262 ASIL-D, the functional automotive safety standard, RTI Connext DDS provides a pathway. Connext DDS Secure offers the only fine-grained security standard appropriate for control applications


and autonomous applications. Manufacturers can selectively apply need-based security policies, such as authentication, access control and encryption to specific use cases. Connext DDS is a data-centric, interoperable framework that supports nearly 100 different platforms. It supports


the use of DDS in both the Robotic Operating System (ROS2) and AUTOSAR Adaptive platform. RTI


u +44 (20) 3887-2818


Smiths Interconnect at DSEI 2019, stand #S3-520 A


u www.rti.com


n extensive portfolio of solutions to be exhibited for Radar, Communications, ISR and Electronic Warfare. Smiths Interconnect, a division of Smiths Group plc, will


be exhibiting at DSEI 2019 in London on September 10th–13th on stand #S3-520. A range of technically differentiated connectivity solutions from its technology brands EMC Technology, Hypertac, IDI, Lorch, Millitech, RF Labs, Sabritec, TECOM, and Trak will be on display, including antennas and tracking systems, RF components, connectors and cable assemblies for defence market applications. Defence connectivity products on display will include high power circular and rugged high- density interconnects, waveguide components, low-loss 50GHz cable assemblies,


attenuators, millimetre wave components as amplifiers and multipliers, 325GHz antenna and networking capabilities. “Smiths Interconnect solutions enhance mission-critical communication systems for Communications, Electronic Warfare, ISR and Radar applications through superior connectivity”, says Paul Harris, VP of Sales and Marketing. “Our technically differentiated solutions provide customers with a competitive advantage when tackling the challenges of higher power, higher data rates, wider bandwidth, and greater connectivity - all within a smaller footprint.”


To learn more, visit us at DSEI 2019, stand #S3-520 Smiths Interconnect


u 020 7004 1600 u www.smithsinterconnect.com


openings suited to cables with and without plugs. This new cable management system consists of a handful of basic components: the actual cable entry frame with an integrated gasket, a two-piece thread and locking adapter plus two-piece locknut to fix it in place, and sealing elements with a range of inlays. Assembly is tool-less, quick, and easy. Cables with and without plugs are simply fed through the enclosure opening and cable entry frame. Slit, tapered, finned sealing elements are fitted around individual cables on the inside. Cables with sealing elements are then pushed back to fit tight in the cable entry frame. I-, T-, and +-shaped inlays are available for M40 and larger openings, allowing for insertion of a variety of cable sealing elements as required.


Modular cable entry for cables with plugs C


ONTA-CLIP expands its cable entry portfolio, launching the KDS-R system for M20 to M63 round


CONTA-CLIP u christian.quade@conta-clip.de u www.conta-clip.com


CONNECTINGINDUSTRY.COM/ELECTRONICS


Cadence® Spectre® X Simulator - Solving large-scale verification simulation challenges


performance gains, while maintaining the golden accuracy customers have come to expect from 25 years of Spectre industry leadership in analog, mixed-signal and RF applications. The new Spectre X simulator can solve 5X larger designs when compared to previous Cadence simulation solutions, enabling customers to effectively simulate circuits containing millions of transistors and billions of parasitics in a post-layout verification flow. The Spectre X Simulator was developed to handle the


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electrical verification of large-scale analog-centric SoC designs (e.g., high-speed SerDes), 5G RFIC designs, and advanced-node IP blocks. It is the perfect solution for a designer who needs analog-type accuracy for designs that require millions of calculations for each time step. The Spectre X Simulator takes advantage of the cloud infrastructure to perform massively distributed simulations required to verify complex full-chip designs in a timely manner.


Cadence u 01344 360333 u www.cadence.com


ELECTRONICS | SEPTEMBER 2019 39


adence® Spectre® X Simulator is a massively parallel circuit simulator designed to provide 3X to 10X


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