FEATURE INTEGRATED CIRCUITS INTELLIGENT
UPDATES Performance boosts for 3.5 inch, Intel Core enhanced SBCs
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ustomers can benefit in several ways from Congatec’s broad board level and solution platform offering: there is a wider product range to choose from and the development of application-ready computing cores for boards and modules is spreading to more and more products, which reduces costs through reuse and lowers prices. Ultimately, even developers using different form factors can take advantage of this access to identical components, BSPs and documentation, which also reduces costs for the OEM. Honing in on the relevantly specific market of 3.5 inch boards, users will find these kinds of benefits via a new player in the market differentiating itself, through added value that other providers cannot or will not afford. For example, customers will profit from lower design-in costs thanks to comprehensive consulting, personal integration support and extensive BSPs. The high design quality of the boards also results in lower maintenance and service costs, less replacement during operation, less system downtime, lower design change costs, lower power consumption and longer board life. To make its entry into the 3.5 inch business an immediate success, Congatec have designed something particular to the company’s purpose for this premiere: just like the conga-TC370 COM Express Type 6 module and the new conga-IC370 Thin Mini ITX motherboard, the company has introduced its first 3.5 inch board with a commercial eighth generation Intel Core Mobile processor (codenamed Whiskey Lake). This gives OEM customers access to the new high-end BGA processor technology at an early stage and the opportunity to succeed, due to to a first-to-market strategy. Today, all boards come with embedded processors with over ten years longevity. But what makes the new Intel Core UE processor so attractive for the 3.5 inch sector?
30 SEPTEMBER 2019 | ELECTRONICS
AN INDUSTRY FIRST: DOUBLE CORES FOR MOBILE COMPUTING The 8th Generation of Intel Core UE processors impresses with 4 SMT- capable cores. This leap from two to four cores, along with the improved microarchitecture, provides a performance increase of up to 58 per cent compared to previous processors - codenamed Kaby Lake - which were only available as dual-core variants. The memory is designed to match this performance boost: two DDR4 SODIMM sockets, with up to 2,400 MT/s, are available for a total of up to 64Gb. This Intel U-Series processor also supports USB 3.1 Gen2, natively. This USB SuperSpeed+ interface is capable of transferring up to 10Gbps or 1.25 Gbyte/s, which makes it possible to transfer data such as uncompressed UHD video from a camera to a monitor. The new conga-JC370 achieves this performance via a rear USB C connector that also supports a 1x DisplayPort++ and power supply for peripheral devices, thereby enabling monitor connection with a single cable.
Congatec’s JC3700 3.5 inch board
Congatec introduces itself into unfamiliar territory: Jürgen Jungbauer, product line manager, brings forth the company’s new 3.5 inch board, the conga-JC3700, equipped with eighth generation Intel Core UE processors, which hopes to improve transmission and ease system integration
Jürgen Jungbauer, product line manager at Congatec
POWERFUL MOBILE GRAPHICS On the rear side, the board features a separate DP++ port, but with optional HDMI configuration. In total, the board supports up to three independent 60Hz UHD displays simultaneously, with a resolution of up to 4096 x 2304 pixels. What’s more, the processor integrates the powerful Intel UHD Graphics 620 GPU. Thanks to faster memory connection in the eighth generation, it is considerably more powerful for high-end graphics applications than that of the predecessor model.
2x Gigabit Ethernet (1x with TSN support), up to 4x UART (1x on the back via D-SUB 9 connector) and a CAN interface are available for the connection of networks and additional peripherals. Various system functions can also be controlled via 1x I2C, 1x SM bus and two additional, integrated feature connectors with eight GPIOs each – with one connector already preconfigured and application ready. A case open intrusion detector provides further protection for the system. A unique offering, building on the Intel Core developments of this generation to broaden Congatec’s offerings within the integrated circuits and embedded markets, overall.
Congatec
www.congatec.com / ELECTRONICS
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