ADVERTORIALS ROLEC’s IP 67 Enclosures For Tough
IIoT And Smart Factory Technology ROLEC’s newly extended aluCASE and technoPLUS electronic enclosures are ideal for a wide range of IIoT and other industrial electronics applications in challenging indoor and outdoor environments. Both are rated IP 66 and IP 67 as standard (IP 69K optional). Diecast aluminium aluCASE is a ‘go
anywhere’ enclosure that can be mounted on machines, walls and bulkheads. It is available in 29 sizes. Versatile technoPLUS features a unique
pole-mounting attachment that enables the enclosures to be mounted either vertically or horizontally. The housings are moulded in five standard sizes from tough and UV-resistant ASA Luran in light grey. Both aluCASE and technoPLUS can be installed ‘lid closed’ to protect the seal and
electronics. Both feature a large recessed lid for fitting a membrane keypad, front plate or product label. All ROLEC enclosures can be supplied fully customised.
ROLEC u
www.rolec-enclosures.co.uk/en/products/ip67-enclosures/
OKW’s EASYTEC IIoT/Sensor
Enclosures Now In Four New Sizes OKW has added four new sizes to its EASYTEC range of fast-mount flanged enclosures. The new larger sizes suit more complex applications that require extra installation volume – such as IoT/IIoT electronics, IT network technology and smart factory sensor equipment. EASYTEC can be mounted quickly
and easily on poles or flat surfaces in challenging industrial environments – either indoors or outdoors. Its flat base has a curved recess for fitting to round poles. Integrated mounting lugs feature apertures for cable ties and holes for panhead screws. The top is soft contoured for superior ergonomics. EASYTEC can be sealed to IP 65 and is now available eight sizes from 101 x 50 x 22 mm to
172 x 93 x 46 mm. The enclosures are moulded from tough and UV-stable ASA+PC-FR (UL 94 V-0) in off-white (RAL 9002) as standard. The enclosures can be supplied fully customised.
OKW u
www.okw.co.uk/en/Plastic-enclosures/Easytec.htm
Smiths Interconnect Offers Quick- Delivery Galileo Test Socket for Rapid Device Bring Up, Characterization,
and Failure Analysis Smiths Interconnect, a leading provider of innovative solutions for semiconductor test applications, announces today its new Galileo test socket for Area Array and Peripheral Package Test. Galileo is an innovative, low-profile test socket engineered to support today’s high
performance Digital and RF applications. It leverages proven interposer elastomer technology and advanced 3D printing manufacturing to provide a high-performance solution for BGA, LGA, QFP, SOIC, or QFN packaged devices with extremely short lead times. “A good portion of customers have products with critical time-to-market (TTM) goals.
When speed is what they need, the Galileo test socket provides an accurate, at-speed and cost-competitive test solution. Given the efficiency it provides, we have named the product after the Italian physicist and engineer, Galileo who made a significant contribution to speed and velocity studies”, said Bruce Valentine, Vice President and General Manager of the Semiconductor Test Business Unit at Smiths Interconnect.
Smiths Interconnect u
www.smithsinterconnect.com OCTOBER 2021 DESIGN SOLUTIONS 55 BCN3D releases brand new Cloud for
real-time 3D printing fleet management • BCN3D makes strides in its software strategy by releasing an enterprise-grade solution focused on streamlined workflows, fleets and team management as well as privacy & security through a set of three different plans: Standard, Teams, and Private.
• This major update is based on the core technology of recently acquired cloud software company AstroPrint, making it the first release led by the new software team.
Link to video:
https://youtu.be/lwaeNbyAOLA BCN3D, a leading 3D printing solutions manufacturer, has announced a complete
reinvigoration of its current BCN3D Cloud platform. The new web-based cloud will allow companies to scale up their additive manufacturing (AM) operations and make entire printing workflows more efficient, controlled, and easier than ever before. The introduction of the new software follows a number of hardware innovations at
BCN3D - including the recently launched Smart Cabinet - which were developed to meet rapidly growing demand for 3D printing. The new BCN3D Cloud centralises all aspects of remote printer and resource
management into one place for the easy implementation of a systematic workflow. Bringing a completely renewed experience and interface for users, BCN3D’s new platform is available under three different plans - Standard, Teams and Private. The BCN3D Cloud Standard plan is included for all BCN3D customers (Epsilon Series
and Sigma D25) and is ideal for driving the adoption of additive manufacturing within companies. Its main features are the digital library, queues management, organising and prioritising print jobs and clusters. These allow users to group printers according to their different characteristics or capabilities and to view statistics for real-time analysis. The BCN3D Cloud Teams allows advanced organisations to administrate a departmental
structure with customised roles and permissions for members. This plan also includes the Workflows feature, which enables several workflows to be created to effectively manage and control the printing process, all the way from design to the final piece. Depending on the role, some users can add files to the workflow while others are responsible for managing the printing process. The Teams plan will be available from late October onwards for a three-month probation period and will then be priced at 495¤ per year (595$/year). The BCN3D Cloud Private is an on-demand plan for corporations with very specific
privacy and security requirements. Daniel Arroyo, Chief Software Officer of BCN3D, said: “The integration of AM processes
is becoming more critical for BCN3D’s clients because the applications are more demanding, with BCN3D machines often printing for more than 12 hours a day on average. With increasing printed part volumes, more people, and more machines interacting, the workflow needs to be robust and seamless. To support those customer needs, our vision is to provide software layers that add value to the hardware, effectively closing the circle of an enterprise-level solution.”
BCN3D u 01257 228411 u
enquiries@3dgbire.com u
https://3dgbire.com
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