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PRODUCTS
FASTENINGS & ADHESIVES
new series of light curable adhesives for wearable electronics is designed with skin sensitivity in mind
A new series of next generation light curable encapsulants and structural and optical- positioning adhesives has been launched by Intertronics for the consumer wearable electronics market. The Dymax 9200-W Series has been developed without isobornyl acrylate (IBOA), a common skin irritant. “Globally, there has been a remarkable
increase in consumer demand for smartwatches, headphones, hearing aids, AR/VR glasses, and other consumer electronics products in the last few years,” explained Ben Swanson, chief commercial officer at Intertronics. “These new materials incorporate all the technical and process benefits of light curable materials to the consumer wearables market, while being designed specifically with skin sensitivity in mind. This brings manufacturers confidence that their products will be safe, reliable and long-lasting for consumers.” The four products in the series are suited
to different parts of the assembly process, and can be used individually, or in combination, for a total solution. During the assembly of wearable electronics,
the materials are suitable for optical and lens positioning, assembly bonding and sealing, electronics encapsulation, wire and flex tacking, and structural bonding. They provide high bond
strength, excellent moisture resistance, and are made of 100% solids to ensure no solvents are released during application and curing. The materials also cure on demand in seconds on exposure to the correct wavelength of light. Manufacturers can also opt for one of the two formulations, with secondary moisture cure that aids the curing of shadow areas. The series includes four grades:
• Dymax 9201-W, a high viscosity light and moisture cure encapsulant, offers a secondary moisture cure for applications with shadowed areas such as chip on board, chip on flex, or wire bonding. It is recommended for surfaces including FR4 and Polyimide.
• Dymax 9202-W is a low-shrinkage material designed for optical alignment and lens positioning applications where low to minimum movement is required, such as lens positioning. It is suitable for applications with full light access or minimal light shadow, when bonding glass, metals, ceramics, FR4, and PC.
• Dymax 9210-W is a high viscosity moisture cure encapsulant designed for the selective protection of components from chemical or
environmental exposures. It is both LED and broad spectrum curable, optimised for 405nm.
• Dymax 9211-W is designed for camera module assembly and is low shrinkage, low stress, and curable with both broad spectrum and LED lamps. It is recommended for bonding a wide range of substrates including ABS, FR4, LCP, PA6, PC, PET, PETG, PI, PU, and TPU.
Intertronics T: 01865 842842
www.intertronics.co.uk
DS-JUL21-KINGSTON:DS-JUL21-KINGSTON 02/08/2021 14:06 Page 1
ISO 10993 LED UV Light Curing Adhesives
Dymax adhesives, sealants, coatings, gaskets and encapsulants for medical device assembly offer:
• ISO 10993 certi cation • Cure in seconds
• Quality assurance features including Encompass™ for visible cure and placement veri cation
• A wide range to choose from; nd the most suitable for your substrates and application
01865 842842
info@intertronics.co.uk intertronics.co.uk
3 DESIGN SOLUTIONS SEPTEMBER 2023 2
Intertronics Medical Device Adhesives Qtr Page 126x86 ad
• Technology from a global leader in UV curing materials and systems
In addition to materials, we offer matched application and curing equipment for a complete process.
Find out more from Dymax’s most experienced distributor in Europe.
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