Signal conditioning
Moore’s Law tells us that the speed and capability of computers will double every two years due to the growing number of transistors that a microchip can contain. So, as microelectronics marches on, what d oes this mean for manufacturers? Here Matt Nicholas, product design manager at sensing and
measurement specialist Mantracourt, explains how electronics assembly is evolving and how manufacturers can keep up with the latest assembly trends.
36
REDUCING COMPLEXITY AND DRIVING FORWARD MICROELECTRONICS
he Microelectronics Revolution brought us the silicon chip, which has transformed our lives significantly. Producing transistors using silicon meant they could be made small enough to fit on a microchip for the first time, opening the door to a new world of gadgets and devices. Now, we are experiencing a second Microelectronics Revolution, where manufacturers are applying their expertise to reducing component size and improving efficiency.
T
THE CHALLENGE OF ASSEMBLY Traditionally, electronics assembly was seen as challenging because engineers would need to take various components and bring them together in one composite unit. For instance, at the design stage, they must choose a ground plane before selecting and positioning the different components.
Like any technical industry, dedicated skills and expertise are vital, whether this is gathering, soldering or integrating certain components. For example, assembling a printed circuit board (PCB) for a device like a pressure sensor is no mean feat: once the components have been soldered and installed on the PCB, the necessary components must be attached to a fully operational electronic device.
THE RISE OF MICROPROCESSORS One area where we are seeing remarkable advancements is microprocessors, which are becoming more powerful and contain new features to improve accessibility. For example, the proliferation of analogue-to- digital converter (ADC) functions are enabling micro-processor-controlled circuits and other digital logic circuits to communicate. Most sensors produce analogue output
March 2023 Instrumentation Monthly
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40 |
Page 41 |
Page 42 |
Page 43 |
Page 44 |
Page 45 |
Page 46 |
Page 47 |
Page 48 |
Page 49 |
Page 50 |
Page 51 |
Page 52 |
Page 53 |
Page 54 |
Page 55 |
Page 56 |
Page 57 |
Page 58 |
Page 59 |
Page 60 |
Page 61 |
Page 62 |
Page 63 |
Page 64 |
Page 65 |
Page 66 |
Page 67 |
Page 68 |
Page 69 |
Page 70 |
Page 71 |
Page 72 |
Page 73 |
Page 74 |
Page 75 |
Page 76 |
Page 77 |
Page 78 |
Page 79 |
Page 80 |
Page 81 |
Page 82