Company insight
screw thread into the connector through the PCB and be torqued to allow a strong connection. However, this process requires a lot of manual labor and is prone to error. Solder-in-place solutions seek to provide PCB retention strength similar to threaded fasteners but using only solder-based processes that can be performed automatically on the PCB assembly line.”
Implementing solder-in- place solutions
There are two primary ways to implement solder-in-place solutions: through-hole mounting and surface-mount technology. Through-hole mounting is generally favoured for its superior strength. This method involves drilling holes through the PCB, plating the walls of the holes and soldering the connector’s solderable posts into the holes. While this process can be prone to errors such as solder paste squeezing through the hole or not wetting the entire wall surface, Omnetics has developed solutions to mitigate these issues, including attaching solderable posts into standard threaded holes in Nano-D and Micro-D connectors, which allows them to
convert their COTS products into solderable solutions. Surface-mount solutions offer greater ease of implementation in production lines. This method involves soldering the connector to flat metallic pads on the surface of the PCB. To ensure a strong and reliable connection, it is crucial to make the retention solder pads as large as possible. For high-reliability surface- mount connectors, the most common strategy is to solder directly to the metal shell for the retention connection. Omnetics provides a range of solutions for both through-hole and surface-mount implementations, underscoring its commitment to meeting diverse customer needs. For surface-mount connectors, Omnetics often utilises gold plating to provide a high-quality surface for the solder to wet onto. To facilitate this, some connector shells are designed with ‘feet’ that increase the soldering surface area and provide a wider base which can resist higher forces.
Bringing it all together The applications of phased array communication systems are diverse and
continue to expand. Some of the key areas where this technology is making a significant impact include commercial aviation (providing in-flight Wi-Fi for passengers), military aviation (enhancing communication capabilities for military aircraft), navy communications (improving ship-to-ship and ship-to-shore communication), and space communications (enabling high- bandwidth communication between spacecraft and ground stations). High-volume design is crucial for meeting the escalating demand for phased array communication systems. Omnetics’ dedication to providing innovative and cost- effective solutions, coupled with its focus on modular design and solder-in-place technology, positions it as a leader in enabling seamless connectivity for a wide array of applications.
As phased array technology continues to evolve, Omnetics remains committed to pushing the boundaries of high-volume design, ensuring that its connectors and cable solutions meet the ever-increasing demands of this dynamic field. ●
www.omnetics.com
Defence & Security Systems International /
www.defence-and-security.com
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