Company insight
High-volume design in phased array
hased array communication systems are revolutionising connectivity, offering unparalleled
reliability, bandwidth and low latency. As demand for these systems surges, so does the need for high-volume designs that cater to diverse industries.
communication systems P
Omnetics’ approach to high-volume design Low Earth Orbit (LEO) satellite constellations, with their high reliability and low latency, are fundamental to modern phased array communications. These constellations rely on numerous interconnected satellites and advanced phased array antennas that utilise thousands of miniature antennas and sophisticated algorithms to electronically steer signals. This steering is a significant leap from the older, mechanically-steered Geostationary Orbit (GSO) satellites. Eric Bergquist, project engineer at Omnetics, highlights this shift: “This wasn’t needed when GSO satellites were the main method of communication, as all of the tracking was slow and could be done mechanically. However, mechanical systems are more expensive and prone to failure than the fully solid-state and electronically-controlled phased array antenna.”
Omnetics recognises the critical role of high-volume design in meeting the growing demand for these phased array communication systems. “Due to the many benefits of phased array communications, it is being implemented widely in many different applications,” says Bergquist. “This means the production volumes for these systems are quite high compared to other projects requiring ultra-high-reliability.” To maintain its competitive edge, Omnetics prioritises continuous
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Eric Bergquist, project engineer at Omnetics, helps us delve into the intricacies of high-volume design in phased array communication systems, and shows us how Omnetics is tackling the challenges of high- volume production to meet the escalating demand for these advanced communication architectures.
Omnetics compact connector solutions for compact installations, surface mount PZN and wired shown.
improvement and innovation. “To compete for these contracts, Omnetics needs to look at each project and implement any design changes or improvements that will allow us to provide a lower unit cost and to get product out the door faster,” Bergquist explains. “This also involves designing the product to facilitate faster and more efficient integration into the customers’ systems.” Central to Omnetics’ high-volume design strategy is the use of many smaller modules interconnected through a backplane. This modular approach not only simplifies manufacturing but also enhances production efficiency. Bergquist elaborates on the benefits of this approach: “The first reason (or drive perhaps) is that traditional array systems are very large, so it is impractical to manufacture the antenna as a monolithic system. The second is that, much like wafers for computer processors, the likelihood of fallout is proportional to the area of the board being manufactured. By manufacturing smaller modules, a lower
percentage of them will have to be discarded due to manufacturing errors.”
The growing trend of solder-in- place solutions
In addition to modular design, Omnetics has embraced solder-in-place solutions as a robust and reliable method for board mounting. “One of the critical requirements for high reliability applications is having a strong connection to the PCB,” says Bergquist. “These connectors will potentially see significant stress in their life, including launching into space, rough handling in the field, and so on.” Solder-in-place technology offers several advantages. It provides a strong connection to the PCB, comparable to traditional threaded fasteners, while also being amenable to automation, which reduces manual labor and potential errors. Bergquist explains, “For almost all common high- reliability connector standards, the high- strength PCB retention solution is to have a
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