INW10AD_GlobalSMT / size W203 º H275 / 090723 KOBARU
Welcoming 1,500 exhibitors & 70,000 visitors!
Title
(*expected)
ASIA'S LARGEST Exhibition for Electronics Design, R&D and Manufacturing
2 shows newly launched!
39th INTERNEPCON JAPAN 11th INTERNATIONAL ELECTRONIC COMPONENTS TRADE SHOW
27th ELECTROTEST JAPAN 3rd PHOTONICS JAPAN 2010
(FORMERLY LASER & OPTICS)
11th IC PACKAGING TECHNOLOGY EXPO 1st ADVANCED ELECTRONIC MATERIALS EXPO
NEW
11th PRINTED WIRING BOARDS EXPO 2nd INT'L AUTOMOTIVE ELECTRONICS TECHNOLOGY EXPO
1st EV & HEV DRIVE SYSTEM TECHNOLOGY EXPO NEW
Jan. 20
[
Wed
]
– 22
[
Fri
]
, 2010
Japan, Tokyo Big Sight
Organised by: Reed Exhibitions Japan Ltd.
Exhibiting & Visiting Information >>>
www.nepconworld.jp/en/
NEPCON WORLD JAPAN Show Management
Organised by
Attn: Hajime Suzuki (Mr.), Kanako Otsuka (Ms.), Taikoku Kin (Mr.)
Reed Exhibitions Japan Ltd. TEL: +81-3-3349-8502
18F Shinjuku-Nomura Bldg., FAX: +81-3-3349-4900
www.globalsmt.net
1-26-2 Nishish
Global SMT & Packaging – October 2009 –
injuku, Shinjuku-ku, E-mail:
inw@reedexpo.co.jp
57
Tokyo 163-0570, Japan
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40 |
Page 41 |
Page 42 |
Page 43 |
Page 44 |
Page 45 |
Page 46 |
Page 47 |
Page 48 |
Page 49 |
Page 50 |
Page 51 |
Page 52 |
Page 53 |
Page 54 |
Page 55 |
Page 56 |
Page 57 |
Page 58 |
Page 59 |
Page 60