Pb-free solder creep-fatigue reliability models updated and extended
Figure 1. Weibull plots for various Pb-free solder joints showing the relative Figure 2. Weibull plots for solder joints of two Pb-free SAC showing the relative
reliability performances under accelerated test conditions. reliability performances under accelerated test conditions.
Figure 4. Manson-Coffin plot of SnPb and SAC405/305 solder joint accelerated
Figure 3. Weibull plots for Sn37Pb and Pb-free solder joints for severe—65⇔+150°C creep-fatigue test results together with the model plots for these solders for both ac-
thermal cycling showing the relative reliability performances under accelerated test celerated testing and product operation. [Sources: Jean-Paul Clech, EPSI Inc.; Ref.
conditions. [Source: Dave Hillman, Rockwell Collins, USA]. 4; Bell Telephone Laboratories data base, others].
Figure 5. Manson-Coffin plot of model predictions of the cyclic lives of solder joints Figure 6. Manson-Coffin plot of model predictions of the creep-fatigue reliability of
consisting of SnPb and various Pb-free solders under accelerated test conditions with solder joints consisting of SnPb and various Pb-free solders under product operating
10 minute dwells and a mean cyclic temperature of 50°C. conditions with 600 minute dwells and a mean cyclic temperature of 50°C.
conditions for similar shear strains is reductions in cyclic life. Global SMT & Packaging, Vol. 8, No.
clearly evident. 12, December 2008, pp. 46-48.
SnAg solders result in creep-fatigue references: 2. Engelmaier, W., “How to Estimate
results very similar to SnPb solder joints; 1. Engelmaier, W., “Creep-Fatigue Solder Joint Reliability, Part 1,” Global
however, reducing the Ag-content in Model for SAC405/305 Solder Joint SMT & Packaging, Vol. 7, No. 9,
the SAC solders will result in significant Reliability Estimation—A Proposal,” September 2007, pp. 60-64.
38 – Global SMT & Packaging – October 2009 www.globalsmt.net
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