Front End
FTDI unveils EVE as it moves into HMI applications Is the world coming alive to envelope tracking? Can price transparency really help?
Thermal Management Taking inspiration from nature
Leading edge thermal management
Cambridge Nanotherm introduces a new thermal management substrate that uses nano-ceramic dielectrics. Steven Curtis talks to CIE about this new technology
Comment - America II Blended distribution leads the way Defence & Obsolescence
14-15 14
America II’s marketing director, Anton Wurr, shares his outlook on what constitutes good distribution practice in 2013
16-19
4-9
4 6 8
10-13 10
Based on structures found in nature Will Battrick, from thermal management specialists Versarien, looks at an advanced heat transfer mechanism for next generation electronic designs
12
Power Management
Contents 26-31
Reducing losses across all load conditions
William Smith considers how design engineers can meet the design challenges that are associated with ‘green’ power in embedded applications
Product News
New products include: an EN50155 compliant DC-DC converter for railway applications from CUI; Murata extends the power rating of its 5.2kV isolation miniature DC-DC converters while HiTek Power launched a new 10kW high voltage power supply system
Embedded silicon for smart meter designs
As the take up of smart meters accelerates we look at embedded smart design and consider some of the new technologies aiding the design process
Switch Technology Membrane or touchscreen? Raising our game
The defence market in Europe is facing profound change over the next ten years. Neil Tyler looks at how the market is changing and adapting to a new environment
Supply chain security challenges
Supply chain security remains among the top five security threats for 2013
Interview - Future Electronics Different levels of interaction are crucial
Interconnection Product News
20-21 20
Future Electronics’ Steve Carr talks to CIE about the distributor’s new specialist power division
22-25 22
February saw Harting unveil a new miniaturised connection technology; Cambridge Connectors launching a new broadcast range of ultra-high definition connectors and TE releasing a connector specifically tailored to the needs of LED products
Taking distribution seriously
Neil Tyler talks connector distribution and manufacturing with Simon Hammerton, the managing director of FC Lane
Editor: Neil Tyler
neil.tyler@cieonline.co.uk T) 0845 013 8429
M) 07985 607730
Publication Manager: Pippa Dugmore
pdugmore@cieonline.co.uk T) 0845 313 0211
Contributor: Steve Rogerson Design: Eric Ridden
TOTAL AVERAGE NET CIRCULATION ABC 14,001 Nov 2011-Jan 2012
F) 0845 337 4960 24 18 Distribution Distribution News
34-37 34
Among the stories that caught CIE’s attention last month was the news that Cyntech Components had licensed the Raspberry Pi logo to brand its enclosures and accessories ranges while RS Components announced that over 300,000 3D CAD models had been downloaded from its website
When the design effort pays off
CIE looks at how niche distributor, L2Tek, working with the BBC was able to convert its technical support for a customer into a successful commercial design
Who? What? Why? Where? When? & How? 42 Following the rules
42
A new perspective on disobeying the rules and Steve Rogerson finds that electronics and water do mix
Subscriptions: Components in Electronics magazine is published ten times each year on a controlled circulation basis in the UK. Register online at:
www.cieonline.co.uk
CIE is also available on annual subscription in the UK and Europe (£60), and the rest of the World (£149.50). Subscribe by emailing your contact details to
cie@capsule-group.com
Circulation: Capsule Publishing Services Limited, 4 Horsted Square, Bellbrook Business Park, Uckfield, East Sussex TN22 1QG Email:
cie@capsule-group.com. T) (0333) 577 0801. F) (0845) 604 2327
Published by Specialist Business Media Ltd 8-10 Dryden Street, Covent Garden, London, WC2E 9NA
Printed by: The Manson Group, St Albans
© Copyright Specialist Business Media Ltd 2013. All rights reserved. No part of this publication may be reproduced or transmitted in any form by any means, electronic or mechanical, including recording, photocopying or any information storage or retrieval system, without written permission from the Publisher.
36 16
Changing market requirements, especially the rise of the touchscreen, are putting pressure on manufacturers of membrane keypads. But, as Paul Bennett explains, membrane technologies are evolving to meet the challenge
32-33 32
30 28 26
www.cieonline.co.uk
Components in Electronics March 2013 3
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40 |
Page 41 |
Page 42 |
Page 43 |
Page 44