Thermal Management
Figure 2: Mixture is compacted
Figure 4: Removal of non-metallic particles from the mixture
pure, gas-atomised copper powder, with a nominal 50 m particle size. Its pore morphology can be tuned to fit specific application requirements, with pore diameters between 20 µm and 1.5 mm being offered. The material’s porosity levels can also be adjusted, as required, from 50% up to 80%. By utilising smaller pore sizes heat transfer rates will be heightened, but this will call for a stronger pump to push the fluid through it. Engineers therefore have the ability to
Figure 3: Extreme levels of heat are applied to the mixture
to ten times more effective than conventional micro-channel heat sinks of equivalent size at dissipating heat energy. This means that a considerable reduction in
heat sink size and weight can be witnessed. A heat transfer coefficient of up to 200 kW/m2K can be achieved. VersarienCu is fabricated from 99.7%
trade off between the level of thermal efficiency and overall expense of the system, optimising their solution for operational performance or for cost as required – if a larger pore size offers sufficient heat dissipation then the bill of materials can be kept low, or vice versa.
Conclusion
Thermal management solutions capable of enhancing heat transfer capacity levels,
while simultaneously being cost-effective, will be of prime importance to the electronic engineering community in the coming years, particularly as the performance enveloped is stretched ever wider. With the heat that systems designs are exposed to continuing to rise and the space into which they are implemented now being at a premium, conventional heat transfer methods will become totally inadequate. By taking inspiration from nature, micro-porous metallic materials may hold the answer to this problem and lead to the lightweight, high efficiency and economical thermal interfaces that multiple industry sectors are starting to demand.
Versarien |
www.versarien.com
Will Battrick is the Technical Director at Versarien
www.cieonline.co.uk
Components in Electronics
March 2013 11
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