news review imec: electronics stretches like skin
RESEARCH institute imec has integrated an ultra-thin, flexible chip with bendable and stretchable interconnects into a package that adapts dynamically to curving and bending surfaces.
The resulting circuitry can be embedded in medical and lifestyle applications where user comfort and unobtrusiveness is key, such as wearable health monitors or smart clothing.
At the 2012 ESTC conference (Electronics System Integration Technology Conference) in Amsterdam, the researchers will present their results and showcase their latest demonstrations. Today, most electronic appliances are rigid and mechanically flexible. A growing number of applications, however, require electronics that dynamically adapt to curving and bending surfaces.
For example, biomedical systems such as unobtrusive, wearable health monitors (e.g. electrocardiogram or temperature sensors), advanced surgical tools, or consumer electronics such as mobile phones embedded in smart textiles are needed.
Imec’s associated lab at the University of Ghent has pioneered this technology and is inviting industrial partners to join the R&D program.
For the demonstration, the researchers thinned a commercially available microcontroller down to 30µm, preserving the electrical performance and functionality. This die was then embedded in a slim polyimide package (40-50µm thick).
Next, this ultrathin chip was integrated with stretchable electrical wiring. These were realised by patterning polyimide-supported meandering horseshoe-shaped wires, a technology developed and optimised at the lab.
Fujitsu shifts LSI facilities to J-Devices
FUJITSU SEMICONDUCTOR LIMITED will transfer ownership of its Large Scale Integration (LSI) assembly and test facilities belonging to its fully owned subsidiary, Fujitsu Integrated Microtechnology Limited (FIM), to J-Devices Corporation.
The objective of the agreement is for the two companies to build a long-term, mutually beneficial strategic partnership in the semiconductor manufacturing business.
It is expected that a conclusive agreement will be signed and the transaction completed by the end of this year. Fujitsu Semiconductor has been striving to enhance its business foundation and improve corporate management by pursuing a unique “fab-lite” business model, as announced in 2009. As part of these efforts, the company has been optimising its manufacturing resources in accordance with changes in the economic and business environment.
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www.siliconsemiconductor.net Issue IV 2012
As one of Japan’s largest independent companies devoted to semiconductor assembly and test operations for customers, J-Devices believes that, to further expand its business, it must be cost-competitive with business rivals based outside of Japan. To that end, J-Devices believes it is of the utmost importance to extend the scale of its operations.
The ownership transfer of the assembly and test facilities, therefore, is in line with the business objectives and views of both Fujitsu Semiconductor and J- Devices, leading to the signing of the agreement. By the end of this year, ownership of FIM’s Miyagi Plant and Aizu Plant is scheduled to be transferred to J- Devices, which will then take over the operation of these manufacturing facilities.
All employees of the two plants are expected to be transferred to J-Devices. In addition, FIM plans a staged transfer of equipment from its Kyushu Plant to J-
Finally, the package was embedded in an elastomeric substrate, e.g. polydimethylsiloxane (PDMS). In this substrate, the conductors behave as two dimensional springs, enabling greater flexibility while preserving conductivity.
“Future electronic circuitry will stretch and bend like rubber or skin while preserving its conductivity,” says Jan Vanfleteren, responsible for the research on flexible and stretchable electronics at imec’s Ghent lab.
“This breakthrough achievement demonstrates that flexible Ultra-Thin Chip Packages (UTCP) can be integrated with stretchable wiring, paving the way toward fully flexible applications. We anticipate the first appliances will be used in intelligent clothing, with medical applications following later. Once commercial products are introduced, I expect to see clothing with signalisation by using LEDs and sensors to track movements.”
This research is supported by the Agency for Innovation by Science and Technology in Flanders (IWT) through the SBO- BrainSTAR project.
Devices facilities also located in Kyushu, and ultimately will transfer all of its manufacturing capability. After the transfer is complete, the manufacturing currently conducted at FIM’s Kyushu Plant will take place with the same standards for quality at J-Devices’ facilities. Employees of FIM’s Kyushu Plant are scheduled to be transferred to J-Devices or reassigned within the Fujitsu Group.
The products that are currently being manufactured at the assembly and test facilities to be transferred will be produced by J-Devices and will continue to be supplied to customers through Fujitsu Semiconductor.
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