news review
Industry’s First Analogue 3-axis, High-g MEMS Accelerometer
Analog Devices, Inc. (ADI) has revealed what it claims is the industry’s first commercially available analogue, 3-axis, high-g MEMS accelerometer.
The ADXL377 measures acceleration of high-impact events resulting from shock and vibration, within a range of ± 200 g with no signal saturation.
This measurement range, combined with an analogue output that continuously captures impact data, makes the ADXL377 a good sensor for contact sports where the detection of concussive forces can reveal indictors of Traumatic Brain Injury (TBI).
With a bandwidth of 1600Hz, the ADXL377 is also suited for use in industrial equipment where shock levels must be closely monitored. The accelerometer also eliminates the need for alignment and the placement of orthogonal sensors, which significantly simplifies design. ADI says the board space required is reduced by up to
five times compared to typical solutions requiring multiple, single-axis accelerometers. The ADXL377 has also been designed for incorporation into the IZOD 2012 INDYCAR Series driver impact safety system. INDYCAR worked in closely with Analog Devices at the ADXL377 product definition phase.
The resulting device allowed INDYCAR to upgrade the sensors located in its communications earpieces, which are used to measure driver impacts triggered by collisions during practice, time trials and during races, according to Jeff Horton, director of engineering for INDYCAR.
“The new Analog Devices ADXL377 3-axis accelerometer is going to be a great addition to our ear sensor program,” says Horton.
“Not only will the smaller size greatly reduce the manufacturing time needed to place the components into the custom ear
moulds that we make for each of the drivers, it also will allow us to place the accelerometer closer to the ear canal opening which should help with the coupling of the accelerometer to the driver’s head for a more accurate reading. In the past we had to use three separate ICs in each ear to obtain the same amount of data.”
“With TBI now a serious medical concern in many facets of life, from athletes and workers to military personnel, ADI is helping customers design smaller, more accurate and simpler impact systems,” adds Mark Martin, vice president and general manager, MEMS/Sensors group, Analog Devices.
“Because so many of these applications require extreme mobility, the ability to eliminate orthogonal sensors while simultaneously lowering energy consumption means that these battery- operated devices can run longer between charges.”
Renesas electronics and TSMC collaborate
RENESAS ELECTRONICS CORPORATION and TSMC have announced that they have signed an agreement to extend their microcontroller (MCU) technology collaboration to 40 nanometer (nm) embedded flash (eFlash) process technology for manufacturing MCU products used in next-generation automotive and consumer applications such as home appliances.
Renesas previously agreed to outsource MCUs to TSMC using 90nm eFlash process technology. Under the 40nm MCU collaboration, Renesas will outsource MCU production at 40nm and future technologies.
Renesas and TSMC will collaborate to lead in advanced technologies for MCU platform and production by combining Renesas’ MONOS (Metal-Oxide-Nitride- Oxide-Silicon) technology supporting both high reliability and high speed, and high- quality technical support with TSMC’s advanced CMOS process technologies and flexible production capacity.
Furthermore, by making the MONOS process platform available to other semiconductor suppliers around the world (including fabless companies and IDMs), Renesas and TSMC aim to set up an ecosystem and further widen the customer base.
“In order for us to achieve further global growth, we are confident that TSMC will provide us with significant benefits in accelerated time-to-volume production and maximum flexibility in addressing the volatile fluctuation of the market demand,” said Shinichi Iwamoto, Senior Vice
President of Renesas Electronics Corporation. “Based on what we have learned from the Great East Japan Earthquake last year, which brought major impacts to several of our manufacturing sites and our customers businesses, we have been accelerating the construction of the “fab network” as part of the company’s business continuity plan (BCP). By integrating both companies’ world-leading technologies through this collaboration, we will construct a supply structure which secures consistent supply for our customers and also drive the market as a leading MCU supplier aiming to set up an ecosystem for MCUs.”
“Renesas is one of the leaders in the MCU market and the collaboration will help deliver the performance Renesas needs for new production introduction with the level of quality and reliability its customers have come to expect,” said Jason Chen, Senior Vice President of Worldwide Sales and Marketing at TSMC.
Issue 2 2012
www.siliconsemiconductor.net 9
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