CONNECTING THE SILICON SEMICONDUCTOR COMMUNITY Volume 34 Issue 2 2012
contents industry & technology
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news
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Market for power management semiconductor chips rebounds
Jury award $123 million against Mitsubishi
Intel invests over $40 million in universities to push semiconductor Innovation
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09 09
Apple & Samsung standalone CMOS based process revealed
Industry's first analogue 3-axis, high-g MEMS accelerometer
Renesas electronics and TSMC collaborate
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www.siliconsemiconductor.net 5 06 07
Cover Story EpiGaN was only spun out of imec two years ago and has already become a champion for GaN based power electronics developing techniques that could challenge current fears related to compound semiconductors
III-Vs and the silicon roadmap Silicon foundries could switch production from silicon MOSFETs to III-Vs and germanium by the end of this decade. Making this transition is far from trivial, but progress is being made.
Lithography process control enhancements using advanced light source metrology As ArF immersion lithography is extended with multi-patterning techniques, improved process control is required to ensure stable and repeatable performance.
Source measurement unit instrument A source measurement unit (SMU) instrument integrates the capabilities of a precision power supply (PPS) with those of a high-performance digital multimeter (DMM) in a single instrument.
Orders of magnitude - Addressing the semiconductor industry’s exponential needs Peter Berg, Bernt Meßtechnik GmbH and Fred Conroy, Tiger Optics LLC review the progress made in the last 10 years.
Novel 3D integration process flow: backside ‘soft’ via reveal Imec has been working on a via-middle through-Si-via (TSV) approach to 3D stacking. This method is new to industry as it allows for a ‘reveal’ of TSV contacts by using a Si-etch process.
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