Solid State Equipment LLC


ADVANCED PACKAGING SINGLE WAFER WET PROCESSING


TSV RESIST STRIP AND CLEAN


As received – post DRIE


After SSEC Cleaning Si ETCH TO REVEAL Cu TSV


As received – post DRIE


After SSEC Cleaning


As received – post DRIE


After SSEC Cleaning


Optical DRY FILM STRIP


SEM FLUX CLEANING


ISIS 3D


UBM AND RDL METAL ETCH Undercut vs Etch Time


1.5µ 1.7µ


(non-measurable) 0µ


WaferChek™ +15 sec Over-etch


Etch Time Before Etch ssecusa.com After Etch © 2011 SOLID STATE EQUIPMENT LLC +30 sec Over-etch


ADVANCED PACKAGING SINGLE WAFER WET PROCESSING


Undercut (µ)


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