24
nanotimes
Companies Facts
Furthermore, The Carl Zeiss registration and overlay metrology system for photomasks PROVE™ success- fully passed the Final Acceptance of NuFlare Tech- nology, the world leading supplier of e-beam based mask writers for cutting edge lithography masks. PROVE™ is designed to measure image placement and critical dimension on photomasks with sub- nanometer repeatability and accuracy. Through its superior 193nm optics the system offers higher reso- lution that will enable the EUV mask roadmap. It was collaboratively developed within three years by the Semiconductor Metrology Systems Division in Jena/ Germany, and the Lithography Optics Division in Oberkochen/Germany, it gets manufactured in Jena.
http://www.zeiss.de
C
EA-Leti announced a multi-partner project to demonstrate high-alignment-accuracy (<1µm)
chip-to-wafer structures made by direct metallic bonding. Such structures are required for high-per- formance 3D integrated circuits and could enable a wide range of applications in microelectronics as well as in optoelectronics or MEMS.
Leti has acquired a customized 300mm FC300 pick- and-place tool from SET, Smart Equipment Technolo- gy, to demonstrate the technology. The customized system will be used by the Minalogic PROCEED project. Minalogic is the global competi- tive cluster specialized in micro- and nanotechnolo- gies and embedded intelligence. In addition to Leti and SET, partners are STMicroelectronics, ALES and the CNRS-CEMES. The PROCEED Minalogic project is a 4.2 million-euro, 24-month project that began in December 2009 and is supported by French FIU (Fond Interministeriel Unique).
The chip-to-wafer direct-metallic-bonding techno- logy was developed at Leti to break through certain 3D-integration limitations. For example, the tech- nology allows chips to be attached to a substrate at low temperature and with low bonding pressure. This technology also allows interconnecting the chip and the substrate electrically through local metallic bonding.
“This collaboration puts Leti in a very good worldwi- de position for 3D-technologies development,” said Leti CEO Laurent Malier. “We will identify the key challenges of 3D product engineering, and chip-to- wafer strategy with direct-metallic bonding is a very promising option for overcoming those challenges.”
CEA-Leti researchers and their partners reported on projects that address fundamental challenges facing next-generation computing, medical diagnosis, com- munications, and portable electronics at ISSCC 2011 in San Francisco, USA. One paper featuring CEA-Leti authors includes work on RF (60GHz) communica- tion chips performed in connection with chipmaker STMicroelectronics to target 60GHz Wireless HD Applications. CEA-Leti demonstrates that it is possi- ble to integrate in standard low-cost CMOS 65nm technology a low-power system-on-chip working in the 60GHz frequency band with a data rate up to 3.8Gbps. The data rate is 70 times higher than tra- ditional 54Mbps WiFi technology.
http://www.aselta.com http://www.set-sas.fr http://www.leti.fr/
C
hevron Phillips Chemical Company LP (Chevron Phillips Chemical) will begin producing 40 cSt and 100 cSt high viscosity polyalphaolefins this
11-02/03 :: February / March 2011
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40 |
Page 41 |
Page 42 |
Page 43 |
Page 44 |
Page 45 |
Page 46 |
Page 47 |
Page 48 |
Page 49 |
Page 50 |
Page 51 |
Page 52 |
Page 53 |
Page 54 |
Page 55 |
Page 56 |
Page 57 |
Page 58 |
Page 59 |
Page 60 |
Page 61 |
Page 62 |
Page 63 |
Page 64 |
Page 65 |
Page 66 |
Page 67 |
Page 68 |
Page 69 |
Page 70 |
Page 71 |
Page 72 |
Page 73 |
Page 74 |
Page 75 |
Page 76 |
Page 77 |
Page 78 |
Page 79 |
Page 80 |
Page 81 |
Page 82 |
Page 83 |
Page 84 |
Page 85 |
Page 86 |
Page 87 |
Page 88 |
Page 89 |
Page 90 |
Page 91 |
Page 92 |
Page 93 |
Page 94 |
Page 95