ROADMAP 2020/21

Over the coming 9 to 12 months, Framos’s team is focusing on developing products that support efforts in 3D depth sensing and embedded vision, both through standard and custom products. The D400e series

of products based on Intel’sRealsense technologies will be at the forefront of the company’s development offerings. The engineering focus will be on incorporating the latest Sony sensor technologies, specifically Sony’s Gen 4 global shutter sensors, into the EV ecosystem, and releasing the SLVC-EC 2.0 core library for Xilinx FPGAs. Framos’s custom engineering group will continue to expand its

can be used to accelerate the development of custom advanced machine learning and computer vision algorithms for unique requirements. The AI Gateway is now being trialled in consumer goods inspection systems, with new capabilities helping meet requirements for food, medical, security and industrial applications.

The machine vision company HD Vision Systems is planning to expand its product family in the field of part handling in 2021. In addition to bin picking, systems for handling from the production line, as well as from piles, will be available in the future as standard options. This offers manufacturing companies a simple and reliable solution for integrating shiny or complex surfaces and fibre composite materials into their automation. In addition, a fully automated solution for quality

Imaging Lab and associated services. Customers looking to achieve optimal image quality with their specific components or vision systems can benefit here. Finally, image tuning and

improved colour response and performance are key for applications using Nvidia Jetson SOMs, leveraging Framos’s partnership in Nvidia’s preferred partner programme.

inspection and object handling based on neural networks is in development. This will allow workpieces to be handled inline, and at the same time successfully checked for defects. This solution focuses on simple and intuitive operation for end- users. In this way, it is able to adapt to new workpieces quickly.

Viztronics plans to focus on three aspects over the coming year. Firstly, expanding the functionality of its ZFlex solution, from a 3D camera to an end-to-end bin picking solution, including 3D object detection using deep learning. ZFlex is a 200mm to 2,000mm field-of-view (FOV) camera targeted at bin picking, suitable for small bins as well as euro pallets. The company also plans to launch a high-speed 3D camera (25MP, 5fps) targeted at OEM customers for inline electronics and semiconductor inspection markets. It will also launch its production-ready TransZ for inline 3D inspection of mobile glass screens and other reflective products. Viztronics designs high

resolution 3D cameras for industrial inspection, quality control and vision guided robotics. Alongside ZFlex, it’s other product line currently | @imveurope

available is MicroZ, a 20mm to 200mm FOV camera suitable for challenging inspection problems, such as imaging metallic surface finishes or extremely small features.

In 2020, Photoneo made several successful product and solution releases. Moving towards the end of the year and into the first half of 2021, the company will continue

automation solutions even more universal to help automate projects that were inconceivable before. Extending the range of possible applications and entering new industries will also remain part of the company’s focus moving into 2021.

on the same track, working on further upgrades and enhancements of its existing product portfolio, as well as on completely new releases. The focus of the coming

year will be on improving and optimising industrial processes and applications by implementing advanced automation solutions that deploy intelligent, vision- guided robots. Photoneo will also strive to make its

In 2021, IO Industries will be adding to its lineup of high-performance area scan cameras. These models will feature new high-resolution image sensors including: Gpixel’s GMax3265 (65MP, global shutter, 3.2µm FSI pixels, up to 71fps); On Semiconductor’s XGS 45000 (44.7MP, global shutter, 3.2µm FSI pixels, up to 48fps); and Sony’s IMX530 (24.5MP, global shutter, 2.74µm BSI pixels, up to 106fps). A selection of high-

throughput digital video output interfaces will be offered, including Coaxpress 2.0 via coaxial or fibre cabling, 10/25GigE via SFP+ connections, and 12G-SDI via coaxial cabling. The compact designs with good thermal management and interchangeable lens mounts will bring these


Airy3D will continue to develop its DepthIQ tool, to improve object segmentation in factory automation, metrology and safety. With DepthIQ, Airy3D takes

an economical approach in 3D image sensor design, enabling depth where conventional approaches are too expensive, require too much processing, or take up too much space. DepthIQ can be customised to any CMOS image sensor specification without changes to camera module or lensing, with savings in hardware, size and computational load for

machine and human vision uses. Industrial applications enhanced with DepthIQ include robotic navigation, object avoidance, proximity and positioning, as well as optical inspection, dimensioning, and process control. Safety applications include non-contact button selection and safe distancing. On the consumer side, the

applications that benefit from DepthIQ include low- cost biometric anti-spoof and video conferencing with improved object segmentation capabilities.


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