Roadmap 2018/19
MVTec believes that the trending technologies of deep learning and embedded vision will continue to be highly influential for future machine vision methods and applications. In the coming year the company’s soſtware products Merlic and Halcon will be augmented with new, handy features based on high-end technologies. Te new versions are to be released in Q1 and Q2 2019 respectively. MVTec also plans to increase the usability of
of electronics. Te high degree of light sensitivity coupled with an excellent dynamic range provides a high level of quality for applications involving challenging lighting conditions. Furthermore, in addition to a 31-megapixel
dual-GigE industrial camera, an IP67 GigE camera, a waterproof lens, and a GigE camera with a polarisation sensor, Matrix Vision will also present its first 10-GigE industrial camera solution. Te FPGA implementation of this camera is a special refinement, which reduces the system requirements of the host system. Last but not least, Matrix Vision’s MvImpact
Configuration Studio soſtware is going to be extended with new features.
www.matrix-vision.de
MidOpt – Midwest Optical Systems – will focus on growing and expanding its shortwave infrared (SWIR) filter line. SWIR filters are designed to enhance the image quality of InGaAs cameras, and are useful for applications imaging from 900nm to 2,300nm. Imaging in the SWIR region can allow
systems to see through non-transparent surfaces, helping users visualise underlying features such as fill levels, hidden moisture or tamper-proof security codes. SWIR filters are ideal for inspection in the food and beverage, woodworking, textile and automotive industries. SWIR filters will aid in the development and efficiency of autonomous vehicles and lidar systems.
www.midopt.com
its soſtware in 2019 by adding development and debugging tools. Moreover, the company plans to ease process integration by preparing new features for connecting machine vision soſtware with PLC communication.
www.mvtec.com
In the coming months, Photoneo is going to upgrade its latest products that were released in 2018. Tis includes its Bin Picking Studio for integrators; the autonomous mobile robot Phollower 100; the AI-driven picking application AnyPick that can pick almost any type of non- transparent and non-porous objects, as small as 1 x 1cm; and the high-resolution and high- accuracy close and mid-range PhoXi 3D camera.
developed camera modules with the
i.MX6 processor, suitable for simple embedded imaging applications in cost-sensitive projects, as well as camera modules with
i.MX8 (quad max) processor for high-power applications. Also upcoming is a new PhyCam-M system,
which will make the MIPI standard usable for industrial applications. In addition, Phytec will be pushing its recently released VM-016, a 1-megapixel camera module with global shutter that is able to take images of fast-moving objects.
www.phytec.eu
Te PhoXi 3D camera has a custom CMOS image sensor, which can detect in rapid motion, in addition to scanning static environments – the camera was shortlisted for the Vision Award 2018. Photoneo puts emphasis on its 3D vision
solutions being versatile and easy to use. Te company is planning further expansion worldwide and widening the stratum of applications and industries it has targeted so far.
www.photoneo.com
Phytec is set to commence serial production of its PhyBoard-Nunki embedded imaging kit, which uses the two image processing units of NXP’s
i.MX 6 processor. It is designed for embedded applications with multiple cameras, such as intercom systems with video, quality control applications that require a thermal imaging camera and a colour camera, or stereoscopy applications. Te two camera ports of the kit can be used via five physical interfaces: two parallel PhyCam.P interfaces, two serial PhyCam-S+ interfaces, and a MIPI camera interface. A version of the kit oriented towards thermal imaging will also be available. Te firm will also be introducing newly
48 Imaging and Machine Vision Europe • Yearbook 2018/2019
In the coming year Sick will push its high- speed Ranger3 camera, and bring the benefits of Rapid-On-Chip-Calculation (ROCC) technology into a wider range of applications via product enhancements and new product variants. In doing this, a broader customer group will be able to take advantage of accurate and reliable 3D inspection without having to compromise on production speed. Te development of programmable 2D and
3D vision sensors in the Sick AppSpace eco- system will also continue. In addition to more product variants, tailor-made solutions with a focus on usability for specific applications or user groups will be provided. Sick intends this to reduce the barrier to using machine vision for production efficiency and quality assurance. As an example, Sick’s general 3D sensor TriSpectorP1000 can be turned into a specific robot belt picking sensor with a simple and dedicated user interface, by uploading an app from Sick’s cloud service.
www.sick.com
@imveurope
www.imveurope.com
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