CONTENTS & LEADER


Electro Optics


Contents Focus


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Global photonics to create one million jobs by 2030 l Photonics firms report growth l VCSEL market to be worth $3.1 billion by 2022 l Light- powered silicon chip to enable next-generation AI l Latest news from EPIC


Show report: Photonics West Quantum technologies l Graphene CMOS


integration l Microscopy for brain research l Solid-state lighting l Laser space communications


Feature: Portable spectroscopy 20 Matthew Dale on how mass-producing chip-level spectrometers in standard MEMS foundries can make spectroscopy more affordable


Feature: Temperature 26


management Shrinking optoelectronic components and combining them with silicon devices requires careful consideration of thermal management, finds Andy Extance


12 Show Preview: Laser World 30


of Photonics China A preview of the some of the technology that will be on display at the upcoming trade show in Shanghai in March 2018


Tech focus: Positioning 32


equipment Scaling down the components that position the micro-optics inside advanced endoscopes


EOS news Products Suppliers’ directory


Find the photonics suppliers you need Tech insight: Laser fabric


34


An update from the European Optical Society on upcoming events


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The latest photonics products from around the world


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Using painless blasts of laser light from a wearable fabric to treat painful skin irritations in a single clinic appointment


LEADER JESSICA ROWBURY


A question of scale


Miniaturising photonics components to enable the development of handheld devices is a key theme across many markets, including spectroscopy. Spectrometers have already come a long way since the traditional laboratory instruments, with portable systems being used in the field for applications such as food and agriculture and environmental monitoring. But going one step further and scaling spectrometers down to the chip level, which allows them to be mass- produced in standard MEMS foundries, could bring spectroscopy into a price range that’s more attainable for new users such as consumers. Matthew Dale finds out more on his article starting on page 20.


One issue that arises from integrating photonics components such as lasers onto chips is thermal management. In his feature on page 26, Andy Extance looks at the different approaches to dealing with heat when shrinking optoelectronic components. Also in this issue, there is a report from Photonics West on page 12, discussing the latest technology advances and industry trends, including quantum devices, brain imaging and solid-state lighting.


@electrooptics


EDITORIAL AND ADMINISTRATIVE TEAM Tel: +44 (0)1223 221030 Fax: +44 (0)1223 213385 Editor: Jessica Rowbury jessica.rowbury@europascience.com Managing editor: Greg Blackman greg.blackman@europascience.com Technical writer: Matthew Dale matthew.dale@europascience.com Design: David Houghton david.houghton@europascience.com Zöe Andrews zoe.andrews@europascience.com


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Electro Optics is published 10 times a year by Europa Science Ltd, 4 Signet Court, Cambridge, CB5 8LA, UK Tel: +44 (0)1223 221030 Fax: +44 (0)1223 213385 Web: www.europascience.com ISSN: 0013-4589


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March 2018 Electro Optics 3


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