Feature: Automotive


OCPP evolution and integration Te shiſt to OCPP 2.1 brings a new set of challenges, mainly focused on the charge point’s role as a grid edge intelligence platform. Te controller now needs to act as an advanced power management system: it must respond to grid signals, manage energy storage systems and work with building management infrastructure. Many manufacturers are using dual-stack


approaches with feature flags, allowing them to enable advanced capabilities selectively without completely redesigning the hardware. Tis modular approach to the firmware architecture enables the same hardware platform to serve legacy charge point operators, but also prepare products for future network needs. Communication requirements are


changing, too. Charge point controllers must handle larger message queues, use complex retry logic and keep local transaction records, even during long network outages. For systems in cellular-connected setups or places with unreliable Internet access, these buffering and retry methods are crucial for staying within regulatory standards.


Hardware design implications Te evolving requirements across the electronic and automotive sectors all have significant effects on charge point hardware design. Processing needs have risen sharply, and modern designs typically use ARM Cortex-A processors with at least 512MB of RAM, providing enough computing power for TLS operations, protocol management and user interface tasks. At the same time, security hardware


needs have also tightened, necessitating dedicated secure elements or trusted platform modules. Both offer tamper- proof storage for cryptographic keys and certificates, which should be integrated early in the design process as they influence board layout, power management and firmware start-up systems. Power supply design has become more


complicated, too, as modern charge points must handle the main power electronics at the same time as supporting always-on communication systems, PLC modems, display interfaces, payment terminals and connectivity hardware.


Balancing power use in standby modes


whilst keeping communication ready poses significant efficiency challenges. EMC compliance is more difficult as charge point electronics become more intricate. High-power switching electronics, RF communication systems, PLC modems and sensitive cryptographic processors increase the chances of electromagnetic interference. Careful PCB layout, shielding methods and filter design are essential for achieving CE and UKCA certification.


Future-proofing Modular soſtware architecture has become vital to future-proofing firmware design, since it cleanly separates hardware abstraction layers, communication protocol stacks and application logic. Tis separation allows for protocol updates without affecting safety-critical power control code, lowering certification costs. Over-the-air (OTA) update capability


is vital for maintaining security and meeting regulations throughout multi- year deployments. Production-grade OTA systems require atomic update processes with automatic rollback on failure, signed firmware images with cryptographic checks and staged deployment options. Security hardening goes beyond


cryptographic methods and covers the entire firmware environment. Secure boot processes, memory protection measures and monitoring for unusual activity all strengthen security for connected infrastructure.


Testing and validation complexity Interoperability testing has become one of the most time-consuming parts of charge point validation. Challenges include vehicle manufacturers implementing ISO 15118 with different levels of detail and timing that only emerge during extended testing. While gaining access to a sufficiently broad vehicle test fleet also requires significant investment, and load testing is needed in parallel to verify system performance under peak and degraded operating conditions. Security penetration testing has become


important as independent researchers find vulnerabilities in deployed charging infrastructure. Tis includes network-


accessible interfaces, physical security issues and potential side-channel information leaks. Field trials in realistic deployment settings


confirm what lab testing cannot. Real-world electrical conditions, extreme environments and long operation periods stress systems differently, speeding up wear and exposing design flaws.


In 2026, and beyond Looking ahead, several considerations stand out. Early adoption of advanced features can offer manufacturers competitive procurement advantages, but it also carries the risk of committing to specifications that may still change. To counter this, a modular architecture that allows selective feature activation offers a balanced approach, giving manufacturers the freedom to ship hardware with hidden capabilities that can be activated later through firmware updates, when standards settle. Engaging with standards bodies,


especially CharIN for ISO 15118 and the Open Charge Alliance for OCPP, gives insights into upcoming changes before they become requirements. Being active in engagement and participation affords savvy companies the opportunity to influence how standards evolve and prepare for them sooner than competitors might. Te charging infrastructure market is moving towards platform strategies where hardware supports soſtware-defined functions. So, investing in strong hardware platforms with extra computing capacity and modular firmware architectures that allow rapid feature development will be the road to success. EV charging standards will continue to


change, with more advanced vehicle-grid integrations, improved security needs and a greater focus on interoperability all key to success. Automotive electronics engineers must balance delivering products that meet current needs but are flexible for future standards, and those who do will stay ahead of the game. A final thought from me is to recommend


investing in flexible hardware and firmware platforms instead of quick fixes, and to remain ever-agile as the industry rapidly shiſts toward a fully electric transportation future.


www.electronicsworld.co.uk February 2026 37


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