Contents Regulars 15 Column: Embedded design


04 Technology 05 Event 08 Focus


10 Column: Design with frequency components


12 Column: Silicon systems design Features


17 Silicones for data centre cooling save energy, reduce costs and improve performance


By Dr Dachao Li, Director, APAC Technical Service and Development – Consumer Solution Business, Dow


30 Java: the strongest enabler for adopting agentic AI By Gaël Blondelle, Chief Membership Offi cer, Eclipse Foundation


EDITOR: Stella Josifovska Tel: 01732 885810 Email: sjosifovska@datateam.co.uk


SALES: Richard Setters Tel: +44 (0)7794 805307 Email: rsetters@datateam.co.uk


PRODUCTION/DESIGN: Tania King Email: tking@datateam.co.uk


20 Breaking crypto with hardware attacks By Trevor Martin, ARM Technical Specialist, Hitex


26 New type of compute architecture for Edge AI applications By GP Singh, CEO and Founder, Ambient Scientifi c


32 Tailoring AI and ML models for safety-critical embedded systems By Ricardo Camacho, Director of Safety & Security Compliance, Parasoft


36 Successfully navigating the EV charging standards’ landscape in 2026 Dunstan Power, Managing Director, Smart Charging Consultancy, Versinetic


42 Supplier’s guide / Web locator


COVER SUPPLIED BY AETINA MORE ON PAGES 6-7


ISSN: 1365-4675 PRINTER: Buxton Press Ltd


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38 Analogue linearisation of platinum and nickel RTD thermoresistors By Félix Mateo Lázaro, Electronics Engineer


www.electronicsworld.co.uk February 2026 03


www.electronicsworld.co.uk


Designing intelligent edge systems with Aetina and NVIDIA


February 2026 Volume 131 Issue 2053 £5.90


IN THIS ISSUE: • Power management • Hardware design • Edge AI • Automotive design • Components


Regular columns: • Embedded design


• Design with frequency components • Silicon systems design


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