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Column: Silicon systems design


Figure 2: Example illustrating how a localised defect or failure within one chiplet can propagate via die-to-die interfaces and become observable only at the system boundary [Source: Keysight]


Timing relationships, protocol


dependencies, power delivery effects and software-driven workloads are often invisible during IP-level verification. These behaviours surface only when chiplets are composed into a complete system, frequently late in the development cycle. As a result, verification success cannot be defined solely by local correctness; it must also account for global interaction.


Emergent failure modes in multi-die systems One of the defining characteristics of system-level verification is the appearance of emergent failure modes. These failures do not originate from a single faulty block but arise from interactions across dies, interfaces and operating conditions. Common examples include:


• Cross-chiplet timing violations triggered by shared clocking or asynchronous boundaries;


• Power and thermal coupling effects that alter behaviour under system workloads;


• Protocol mismatches that remain dormant until specific traffic patterns occur;


• Firmware–hardware interactions that expose corner cases unseen in simulation. In multi-die systems, failures that


appear contained or benign at the component level can surface only when system-level interactions and workloads are exercised. In many cases these issues only appear under realistic workloads or long-running system scenarios. Traditional verification environments, optimised for block-level exhaustiveness, are poorly suited to capturing this class of behaviour.


Limits of block and die-level closure Coverage metrics, assertions and constrained-random testing remain essential instruments for local validation. However, in chiplet-based systems, coverage closure is increasingly decoupled from confidence in overall system behaviour. While coverage metrics indicate which


scenarios have been exercised, they provide limited insight into whether complex system-level interactions behave correctly under realistic workloads. Block-level validation typically assumes that correctness is


compositional: if each part behaves correctly in isolation, the integrated system will behave correctly as a whole. In practice, this assumption breaks down when: • Components make incompatible assumptions about ordering, latency, or error handling;


• Die-level environments abstract away shared power, timing and thermal constraints;


• Validation scenarios fail to reflect realistic software-driven workloads. The result is a widening gap between


verification effort and verification effectiveness. Systems may demonstrate strong local


correctness while still harbouring latent integration defects that emerge only during system bring-up or extended operation.


System-level verification techniques Addressing these challenges requires approaches that operate at the system level rather than treating integration as a final validation step. Key techniques include: • Cross-die protocol verification, focusing on end-to-end behaviour


www.electronicsworld.co.uk February 2026 13


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