Semiconductors
mechanical and electrical performance (Table 2).
Figure 2: Board level reliability TCOB (Temperature cycling on board) after 1000 cycles
MLPAK provides uncompromising automotive grade quality and reliability
Unlike flat no-lead packages that can suffer from stress-induced solder cracks, MLPAK strikes a balance: it’s smaller than traditional gull-wing packages but retains mechanical compliance, leaving more than
80 per cent of solder coverage intact even after harsh thermal cycling (Figure 2). MLPAK combines proven automotive grade robustness with cutting edge electrical performance, enabling original equipment manufacturers (OEMs) and Tier-1 suppliers to design systems that are lighter, more efficient, and easier to manufacture.
MLPAK devices are AEC-Q101 qualified and include side wettable flanks to support automated optical inspection (AOI). This feature eliminates the need for costly X-ray inspection while providing clear visual confirmation of solder joint quality, a major benefit for high-volume manufacturing (Figure 3). Additionally, the larger solderable area given by side wettable flanks supports high board-level reliability. MLPAK MOSFETs also deliver comparable thermal performance to LFPAK, with bench tests demonstrating that MLPAK56 and LFPAK56 operate at similar temperatures under identical test conditions (20 kHz, 30 A, 150 W half- bridge switching).
Figure 3: MLPAK features side wettable flanks for AOI and enhanced solderability Table 2: MLPAK33 wirebond board level reliability
MLPAK devices are manufactured using a split gate trench (SGT) technology that delivers higher efficiency by minimising gate charge and reducing both conduction and switching losses. They also feature a reliable wire-bonded internal architecture that maintains excellent thermal,
MLPAK application advantages MLPAK devices can be deployed in various automotive applications to provide designers with a competitive advantage both in performance metrics and cost-of-ownership considerations. The 80 V and 100 V portfolio, built on the latest silicon platform optimised for fast switching, delivers the high efficiency required in 48 V lighting and DC-DC applications. As example applications, 100 V MLPAK devices are well-suited for boost DC-DC converters used in daytime running lights, typically rated at 15 W and operating from 12 V to 60 V, while 80 V devices are well matched to main beam headlights of 30 W of power running from 12 V to 28 V. For high side switches used as isolation in motor control applications such as seat adjustment and front wipers, 40 V MOSFETs offer the strong SOA and avalanche robustness required, while devices with low RDS(on) and high switching efficiency are ideal for 12 V to 48 V converters and auxiliary actuators like window lifters, HVAC flaps, washer pumps, and sunroof motors. Other benefits include reduced electromagnetic interference (EMI) and optimised damping that reduces the need for bulky EMI filters and thereby lowers total system cost.
Conclusion
The shift from ICE to xEV platforms is changing the thermal and mechanical environment inside vehicles. With fewer extreme temperature cycles and less stringent board-level stress, leaded packages are becoming less of a requirement for some vehicle subsystems, making MLPAK an increasingly viable solution that is more suited to the reliability requirements of these xEV platforms. By combining the compact size of leadless designs with the mechanical resilience of leaded packages, MLPAK solves both electrical and manufacturing challenges. 40 V, 60 V, 80 V, and 100 V trench MOSFETs in MLPAK packaging can serve diverse automotive applications from lighting to motor drives to DC-DC converters, while maintaining footprint compatibility, high efficiency, and near-zero-defect reliability. As vehicle electronics continue to grow in complexity and density, MLPAK can become a platform for next-generation automotive power solutions.
https://www.nexperia.com/
www.cieonline.co.uk Components in Electronics October 2025 29
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