Semiconductors
MLPAK: next generation silicon power MOSFET packaging for efficient electric vehicle systems
By Shivas Jogi, MOSFETs business product manager, Steven Duffy, MOSFETs product marketing manager & Christian Radici, MOSFETs application engineer, Nexperia
T
hree mega-trends are currently reshaping automotive power system design. The first is the transition from internal combustion engine (ICE) powered vehicles towards mild-hybrids, plug-in hybrids, and battery-powered electric vehicles (xEVs or EVs). Secondly, feature- rich infotainment systems are becoming more common, even in non-premium cars. Finally, vehicle architectures are moving away from individual ECU control, where each body function has its own control unit, towards domain-based architectures, where multiple applications are grouped into zones managed by a zonal control unit (Figure 1).
These trends not only require the use of more power MOSFETs in DC-DC converters, inverters, and battery management system designs, they are also changing the demands on the packages in which these devices are housed. In this article, Nexperia discusses these changing requirements and how its micro-lead packaged (MLPAK) MOSFETs offer a fit-for-purpose solution for vehicle functions like body control, infotainment, and LED lighting, where devices typically experience only moderate thermal cycling and mechanical stresses. It also explores how MLPAK is constructed to support board-level reliability requirements of electric vehicles while maintaining compatibility with industry-standard footprints and highlights key MLPAK device characteristics that align with the design and performance requirements of many common EV applications.
ICE vs. EV: the changing thermal and electromechanical landscapes In ICE architectures, 12 V electrical systems were primarily responsible for auxiliary loads such as lighting, infotainment, and engine control. Furthermore, components placed in close proximity to an ICE could
28 October 2025
Figure 1: Automotive megatrends are changing expectations of component packaging
experience temperatures of up to 125 °C. On the other hand, while EVs distribute a far greater degree of electrical power to drive motors, manage batteries, and operate thermal systems, often at 48 V and higher, maximum operating temperatures do not exceed 85 °C, meaning components are subjected to lower thermal and mechanical stresses (Table 1). Nonetheless, as current densities rise in 48 V and high- current circuits, minimising conduction and switching losses is critical. Packaging has a crucial role to play in this transition since it directly affects efficiency, reliability, and cost.
The high operating temperatures in ICE powered vehicles require conventional leaded packages for strong thermal and mechanical resilience, though these occupy more PCB space. EVs, while operating
under less extreme conditions, still present harsh thermal and mechanical environments that demand reliable board- level performance. MLPAK meets these requirements, combining robust solder- joint reliability with a compact footprint. MLPAK’s side wettable flanks support automated optical inspection (AOI), ensuring consistent solder quality. Both leaded and micro-leaded options remain viable, with the optimal choice depending on efficiency, performance, cost, and manufacturability.
MLPAK bridges the gap between leaded and leadless
The MLPAK family was developed to bridge the gap between traditional leaded and fully leadless MOSFET packaging, giving designers a practical
Table 1: Comparing electromechanical requirements of ICE powered (left) and electric vehicles (right)
middle ground that balances efficiency, robustness, and compactness. Designed around real application needs, MLPAK delivers a modern, unified footprint that ensures balanced performance, long-term availability, and ease of integration. The portfolio includes two sizes: MLPAK33- WF (3 × 3 mm) for space-constrained designs, and MLPAK56-WF (5 × 6 mm) for applications requiring higher current or thermal capacity. Both are fully compatible with existing LFPAK layouts, making design transitions and reuse seamless. By combining strong electrical and thermal performance with a compact form factor, MLPAK33 and MLPAK56 provide scalable solutions for high-volume automotive applications such as body control, infotainment, and automotive LED lighting systems.
Components in Electronics
www.cieonline.co.uk
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