Advertorials
Honeywell IHM Series Aerospace Proximity Sensors reduce maintenance costs and increase flight hours – now available at Aerco
Enhanced vibration and EMI specification; hermetic sealing; design to meet requirements of today’s composite aircraft
Aerco, the distributor and stockist of electrical and electronic components servicing hi-rel markets, is now stocking Honeywell’s IHM Series Aerospace Proximity Sensors, which boast industry-leading indirect lightning and dielectric ruggedness, plus enhanced vibration and EMI specifications to meet challenging applications found in today’s composite aircraft. Highly accurate and reliable, Honeywell IHM Series Aerospace Proximity Sensors are non-contact devices designed to sense the presence or absence of a target, providing on/off output, plus
Lattice’s low power, small form Factor ECP5 FPGA
enables Ximmerse VR/AR tracking platform Lattice FPGA Technology Provides Low Latency Visual Computing Needed for Inside-out, Outside-In Tracking for Processing at the Edge
they can also be configured with an optional health monitoring output to the host system.
Honeywell IHM Series Proximity Sensors have a hermetically-sealed, all-welded stainless steel construction for exceptional robustness and durability in harsh environments, eliminating any potential for contamination. Due to their non-contact design technology, Honeywell IHM Series Proximity Sensors detect the presence or absence of a target regardless of the often very dirty conditions in which they operate, thereby eliminating mechanical failure mechanisms, increasing revenue and reducing maintenance costs by increasing Mean Time Between Failures (MTBFs) and so minimising downtime. A further feature of the IHM Series Sensors is the optional third output state to indicate the health of the sensor (whether operating optimally or failed), which again reduces maintenance time and delayed flights, helping to lower overall maintenance costs across the lifetime of the aircraft.
Lattice Semiconductor Corporation (NASDAQ: LSCC), the leading provider of customizable smart connectivity solutions, today announced that Guangdong Virtual Reality Technology Co., Ltd. (Ximmerse), a provider of interaction systems for mobile AR/VR applications, has selected Lattice’s ECP5™ FPGA to perform stereo vision computing in their AR/VR tracking platform. Lattice’s market-leading ECP5 FPGAs are ideal for flexible connectivity and acceleration at the edge due to their low power, small form factor and low cost, delivering an energy-efficient, low latency solution.
As the market need for AR/VR environments continues to grow, current head mounted display (HMD)-based systems witness performance issues running content on mobile applications processors (APs). As such, performing visual based positional tracking on the processor has proven challenging. With up to 85K LUTs in a small 10 x 10 mm package, Lattice’s ECP5 FPGA offers lower latency and increased power-efficiency image processing compared to an AP. The programmable fabric and I/Os also allow Ximmerse to easily choose and source the camera sensor from different vendors based on the product requirement.
www.latticesemi.com
Mouser Electronics sponsors CLIK Lab Hackathon at Polytechnic University of Turin
Mouser Electronics, the global authorised distributor with the newest semiconductors and electronic components, is sponsoring the Create the Polito Virtual Butler Hackathon Challenge at the Sept. 27 grand opening of the Contamination Lab & Innovation Kitchen (CLIK) Lab at the Politecnico di Torino. The CLIK Lab is designed to help students of the prestigious Italian engineering university realize and accelerate new projects and innovative ideas.
The Politecnico di Torino will inaugurate the new CLIK Lab by hosting a two-day hackathon that tasks participants with creating voice-controlled home automation solutions. Teams will design and produce a virtual lab assistant based on the Raspberry Pi 3 single-board computer, provided by Mouser Electronics. The virtual assistant designs will perform actions such as controlling video recording, managing automation in the lab, and any other tasks students can devise. Mouser will select the most impressive projects to exhibit at Maker Faire Rome, Dec. 1 through 3.
Mark Patrick, Mouser’s Technical Marketing Manager, EMEA, commented, “This program is a perfect example of how Mouser is positioning itself as a strong supporter of engineering education in Europe, especially in innovation and development. We have worked with CLIK Lab manager Professor Massimo Violante before, and we are sure that his expertise and enthusiasm will ensure that this is a highly successful event.”
www.mouser.com
Power Integrations launches InnoSwitch3, a 94%-efficient offline Flyback Switcher IC family
New InnoSwitch™3 integrated switcher ICs cut losses by 25%, deliver constant efficiency over a wide range of line and load conditions
Power Integrations (Nasdaq: POWI), the leader in high-voltage integrated circuits for energy-efficient power conversion, today announced the release of its InnoSwitch™3 family of offline CV/CC flyback switcher ICs. The new devices achieve up to 94% efficiency across line and load conditions, slashing power supply losses by a further 25% and enabling the development of compact power supplies up to 65 W without heatsinks. InnoSwitch3 devices are ideal for power supplies with challenging energy consumption, footprint or thermal constraints, particularly those targeting mandatory Total Energy Consumption (TEC) specifications.
The InnoSwitch3 IC family is optimized into three application-specific series:
• CE: Current External. Includes accurate CC/CV regulation with external output current sense for optimum design flexibility. Targets compact single-voltage chargers, adapters, IoT and building automation.
• CP: Constant Power. Ideal for USB Power Delivery (PD), rapid charging and other applications where a dynamic output voltage is required.
• EP: Embedded Power. Features the family’s highest-rated MOSFET (725 V) and provides full line and load protection with excellent multi-output cross-regulation for demanding industrial applications and appliances.
www.power.com/products/innoswitch/
OMC launches new small-footprint SMA Tx/Rx housings Smallest footprint; up to 25% space-saving; all-metal package; secure connection to PCB
OMC, the pioneer in optoelectronics manufacturing, has launched two new high density PCB-mounting SMA (H22) style housings for its wide range of fibre optic transmitters and receivers which save board space and ensure long-term performance.
The company has released two new space-saving housing styles: High Density SMA (HDSMA) which is designed to be edge-to-edge stackable while offering enhanced board density, and Vertical SMA (VSMA) which offers an even smaller PCB footprint for applications where devices are used singly on a PCB.
The new high-density HDSMA housing has PCB footprint of 10mm x 7mm, offering a potential increase in device density over the traditional SMA (H22) PCB mount housing of between 22 and 50 percent depending on the amount of board edge available. The package is designed for systems requiring multiple Tx/Rx channels per PCB and features an all-metal, bolt- down design. OMC’s full range of fibre-optic emitter and receiver diodes can be supplied aligned and mounted in the new HDSMA receptacle.
The company’s new Vertical SMA (VSMA) package has a PCB footprint of only 8mm x 7mm which OMC believe makes it the world’s smallest PCB footprint SMA fibre-optic housing. With a modern, slimline design and all-metal body, the VSMA device bolts in place with a single screw and features a locating lip which slots into a groove in the PCB edge to securely fix the device in place. The VSMA package is designed to allow a fibre-optic transmitter or receiver to be incorporated into a PCB design while occupying the minimum possible PCB space. It is available with a wide range of visible and infrared emitters and fibre-optic receivers aligned and mounted within.
The new housings still permit the use of a standard SMA connector with secure hexagonal locking nut. Both have been designed to meet the demand for space-saving fibre-optic devices in the modern age of miniaturisation in which PCB area is at a premium.
www.omc-uk.com TTI signs franchise deal with ITT Cannon and ITT Veam
hi-rel connector lines covering entire European region ITT Cannon and Veam brands address defense, aerospace, transportation, industrial and medical sector applications
TTI, Inc., a world leading specialist distributor of electronic components, has announced that it has signed a franchise distribution agreement with ITT for their Cannon and VEAM brands covering the whole Europe, Middle East, Africa (EMEA) region. ITT is a leading global manufacturer of connector products serving international customers in the aerospace and defense, transportation, industrial and medical end markets through the Cannon and VEAM brands. Previously the agreement was limited only to France.
“ITT Cannon designs and produces a variety of highly engineered interconnect solutions that make it possible to transfer data, signal and power in an increasingly connected world,” says Ronald Velda, Supplier Marketing Director Connectors TTI, Inc. in Europe. “The company’s harsh environment products are an excellent addition to our portfolio as they have been designed to meet the needs of markets that a large part of our customer base operates in.”
“We’re excited to grow our partnership with TTI as they offer customers a comprehensive inventory combined with deep technical product expertise backed by advanced logistics systems,” says Alessandro Durigon, European Sales Director at ITT. “We’ve experienced excellent results in France and we are delighted to expand the agreement to cover the entire EMEA region.”
www.ttieurope.com
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