Advertorials High contrast graphic display SPI/I²C interface


+ touch-screen option MMS Electronics Ltd has available a new series of OLED displays. These OLED displays offer excellent readability with high contrast and very wide viewing angle. Another unique feature is the very fast response time with temperature range from -40°C to +80°C. The EA OLEDL128-6 displays are available in six versions. The standard version is EA OLED128-6LGA. Available in G (Yellow), B (Blue), W (White) and R (Red). The EA OLED128-6GGA has a special scratch, shock, and UV protective front glass. The EA OLED128-6NGA is supplied without polarizer, providing even greater brightness. This version is ideally used behind smoked glass. The module size is 67.8 x 47.9 mm with view area 64 x 37 mm. Interface is SPI and I2


C with


integrated SSD1309 controller. The connecting pins on the displays are a 2.54mm (0.1 in) pitch. Display can be soldered directly into the PCB or plugged into a socket. An analogue resistive touch-screen is available.


MMS Electronics Ltd Tel 01943.877668 www.mmselectronics.co.uk


IP54 certified 2” thermal embedded printer


Craft Data are pleased to introduce the PT100, their latest direct thermal panel/embedded printer. This 2” printer is certified to the IP54 standard and offers an extremely high level of reliability and durability against dust and liquid. The printer mechanism is hidden behind a water and dust proof lockable front facia which also incorporates the printer’s guillotine. An operating temperature of -40°C ~ 55°C makes the PT100 ideal for both indoor and hostile outdoor applications, where temperature and environmental conditions play a key factor. A 120mm/sec print speed, a 48mm/54mm print width plus a resolution of 8 dots/mm enables high quality text, graphics and barcodes to be printed, cut and presented almost instantaneously. The printer is compact, measuring just 149.05(w) x 171.5(h) x 80.5(d)mm and takes a standard 57mm paper roll with a maximum diameter of 50mm. Applications include medical and industrial instrumentation plus a host of other demanding applications.


Contact: Craft Data Limited Tel: 01296 332000 www.craftdata.co.uk


Amphenol’s latest Micro-B series of cost -effective


Orthogonal architecture offers improved SI performance and thermal efficiencies High-Speed


Samtec, a privately held $662MM global manufacturer of a broad line of electronic interconnect solutions, proudly announces the expansion of the ExaMAX®


Backplane Connector System with new DMO options. System designers can now leverage the inherent advantages of direct mate orthogonal architectures when compared with traditional backplane systems.


Samtec’s new ExaMAX DMO solutions offer system designers flexibility by removing the mid-plane, allowing fabric cards and line cards to mate directly. This fast-growing system architecture increases airflow and improves thermal efficiencies throughout the chassis. DMO solutions enhance signal integrity via shorter trace lengths and less connector transitions while streamlining the system BOM and optimizing system cost.


Samtec’s ExaMAX DMO system consists of the new EBDM-RA series which mates directly with existing EBTF-RA series. Currently both 6 pair x 10 column and 6 pair x 12 column solutions are available. Guide pin and screw mount options are also available. 6 pair x 6 column and 6 pair x 8 column options are under development.


"Next generation system designers are quickly adopting DMO architectures," said Jonathan Sprigler, Backplane Product Manager at Samtec, Inc. "Leading equipment vendors from across the data center industry - storage, server, networking and other applications – are leveraging the advantages of DMO via Samtec’s new EBDM-RA series."


Samtec’s EBDM-RA series is but one solution from the ExaMAX High-Speed Backplane Connector System. The ExaMAX line of products are optimized for speeds up to 56 Gbps (PAM-4 modulation). Return loss compliance is achieved in both 85  and 100  systems due to targeting the 92  specifications and controlling reflections at all geometry transitions within the connector.


circular connectors Amphenol Industrial Products Group, a global leader in interconnect systems, now offers a lightweight, high performance circular connector series with a small footprint that provide a viable alternative to high-cost connectors used in a variety of industrial markets needing high signal counts in a very small package.


The Micro-B series utilises a robust triple bayonet coupling that provides quick and positive locking, as well as an internal EMI ground spring for excellent shell-to-shell conductivity at an affordable price.


This new circular connector series was designed for industrial applications such as sensors, data and mobile communications, medical equipment and motor controls where electrical performance must be met with affordability.


The compact, Micro-B features high density insert patterns with size 22D contacts allowing for more circuits to be connected and a simplified termination process with tape and reel contacts. It offers tool-less and fast mating for ease of use in the field. This RoHS-compliant circular connector series meets smoke, toxicity and flammability requirements and offers a high reliability connection for demanding applications.


Technical Specifications


• Operating temperature of -55°C to +125°C • Dielectric withstanding voltage of 500 VRMS • Current rating of 3 to 5 Amps per contact • Durable up to 500 mating cycles • RoHS-compliant • Robust triple bayonet coupling • Tool-less and fast mating


Amphenol www.amphenol-industrial.com


ExaMAX also has the industry’s lowest mating force with excellent normal force and meets Telcordia GR-1217 CORE specifications. With two reliable points of contact at all times, even when subjected to angled mating, residual stubs are minimized for improved signal integrity performance. A 2.4 mm contact wipe increases reliability while the hermaphroditic mating interface ensures stub-free mating and reliable alignment


The backplane system features individual signal wafers with differential pairs in a staggered design and arranged in columns with zero skew. Each wafer includes a one-piece embossed ground structure, which increases isolation to significantly decrease crosstalk.


For more information, please watch the “High-Speed Backplane Connectors Drive 56 Gbps and Beyond” webinar, visit the ExaMAX High-Speed Backplane Connector System landing page, or download the High-Speed Board-to-Board Application Design Guide. Immediate technical support is available from Samtec’s backplane applications experts at HSBP@samtec.com.


About Samtec, Inc.:


Founded in 1976, Samtec is a privately held, $661 million global manufacturer of a broad line of electronic interconnect solutions, including IC-to-Board and IC Packaging, High Speed Board-to-Board, High Speed Cables, Mid-Board and Panel Optics, Flexible Stacking, and Micro/Rugged components and cables. Samtec Technology Centers are dedicated to developing and advancing technologies, strategies and products to optimize both the performance and cost of a system from the bare die to an interface 100 meters away, and all interconnect points in between. With 33 locations in 18 different countries, Samtec’s global presence enables its unmatched customer service. For more information, please visit http://www.samtec.com.


Samtec, Inc., P.O. Box 1147 New Albany, IN 47151-1147 USA


Phone: 1-800-SAMTEC-9 (800-726-8329) www.samtec.com


Samtec Expands ExaMAX®


Backplane Connector System With New Direct Mate Orthogonal (DMO) Options


High-Speed


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