Advertorials
New QSMP-25 solder-down module features next-gen STM32 MPU to enable secure edge AI in Industry 4.0 applications
with high-end multimedia capabilities
Direct Insight, the UK-based technical systems integrator focused on system-on-module (SoM) solutions, can now deliver and support development with QSMP-25 solder-down QFN-style SoMs (system-on- modules), featuring second-generation STMicro STM32 MPUs. “This new QSMP-25 solder-down module delivers an industrial-grade 64-bit solution for secure Industry 4.0 and advanced edge computing applications that require high-end multimedia capabilities,” commented David Pashley, co-founder & Managing Director at Direct Insight. “Incorporating high performance connectivity, multimedia and display, with a Yocto-build mainline Linux BSP, this SoM and price, while simplifying PCB layout and EMI (electromagnetic interference) compliance.” Manufactured by Direct Insight’s long-standing partner, Ka-Ro Electronics, the new QSMP-25 is a 29mm x 29mm QFN-style solder-down system-on-module featuring STMicroelectronics STM32MP255F
Direct Insight
www.directinsight.co.uk
New Seal Type Sliding Switches from Panasonic
Sliding Switches, a new state-of-the-art line of micro switches designed for switches, streamlining assembly, and terminal connections.
• Two-Step Detection Type • Redundancy Type • Failure Detection Type
The Redundancy Type Switch integrates two internal circuits into a compact unit, ensuring continued terminal switch.
NeoMesh as you want it!
Thehe bi-directional wireless mesh networking
Customers have a wide choice now how they want to use and receive the ultra-low-power NeoMesh bi-
• NeoMesh on NCxxxx Modules from NeoCortec • NeoMesh on LoRa™ (wireless modules from Embit) • NeoMesh Licensing from NeoCortec
At Embedded World 2025, NeoCortec, together with its Italian wireless module partner Embit, to customers. The combination of NeoMesh’s simple and massive scalability and low power with Semtech’s LoRa modulation’s proven ability to perform well with a very long range in noisy environments, enhances the value proposition of the two leading wireless technologies.
Power Integrations Names Jennifer Lloyd
former member of Power Integrations’ board of directors, Dr. Lloyd has been reappointed to the company’s board. Both appointments are
of a large global team. Prior roles included leadership of Analog’s precision franchise and its healthcare and consumer unit. Dr. Lloyd holds doctoral, master’s and bachelor’s degrees in electrical engineering and computer science from the Massachusetts Institute of Technology. Author of numerous technical papers and recipient of eight U.S. patents, she has also been active in the IEEE community, having served on the technical program committee for the International Solid-State Circuits Conference (ISSCC), the Custom Integrated Circuits Conference (CICC) and the VLSI Symposia (VLSI). approximately six months to ensure a smooth leadership transition; he is expected to remain a non- executive member of the board thereafter. Bala Iyer will remain in the role of lead independent director.
Power Integrations Semiconductor testing application guide demonstrates
the power of reed relays in modern test systems
of another in its series of educational application guides for engineers building ATE (automatic test equipment) and test & measurement (T&M) systems, titled: ‘5 Reasons Why Reed Relays are Ideal for Semiconductor Testing’. This expert-authored comprehensive application guide explains more about the critical role of reed relays in semiconductor test, particularly during wafer probe testing. The guide reasons why reed relays are the ideal switching technology for semiconductor test. After semiconductor wafers are fabricated, but before they are ‘sliced and diced’ into the dies that will functional tests are performed by wafer probing machines, a type of automatic testing equipment (ATE) that is used to verify the functionality of the individual dies – be they relatively simple structures, such as diodes and transistors, or more complex integrated circuits (ICs), such as processors, microcontrollers, helping improve yield.
Pickering Electronics
www.cieonline.co.uk www.pickeringrelay.com
Semiconductor testing application guide demonstrates the power of reed relays in modern test systems
from Powell
and more for high-rel applications including defense, enables a hybrid combination of transmission media in domino module is made up of two ‘cubes’. The mating face consists of two almost square areas in which larger contacts can also be accommodated. The cubes support transport and use by the customer.
easily integrated into existing systems; existing frames, hoods and housings or connector modules can be signals, data or compressed air, as male and female contacts can be combined in one domino module.
Powell Electronics Components in Electronics
www.powell.com July/August 2025 57
www.power.com
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