EMBEDDED TECH
ASIC, SoC and SiP: perfect partners
Richard Mount, director of sales at ASIC design and supply company Swindon Silicon Systems, breaks down the ASIC, SoC and SiP integrated circuits (ICs) integral to intelligent sensors
A
ccording to Fictiv’s 2022 State of Manufacturing report, 90% of manufacturers are using digital processes. Sitting at the heart of any digital strategy is a smart sensor that converts real-world variables into digitised data. But, as sensor technology grows in sophistication, how can we get all of this extra functionality into a miniature device for a reasonable cost?
ASICs
An ASIC is a custom chip that has been designed specifically for a customer’s individual application. This ensures that the ASIC is unique to any other offering on the market in terms of performance and differentiates the customer’s product from the competition.
ASICs are complex devices containing many functions. As well as including the processing, conditioning and communication functions required for sensor interfacing, designers working on today’s Industrial Internet of Things (IIoT) related products and systems find an ASIC will incorporate a number of cost and performance benefits.
While there is a short-term cost associated with ASIC development, the return on investment is high. By integrating functionality such as the analogue front end, signal processing and IoT connectivity into one system, the overall cost of the final product is much lower compared to its loaded PCB equivalent. Furthermore, because of its size and the fact that an ASIC replaces most of a PCB full of components, the user can expect a much higher efficiency and lower power consumption than they would receive from an off-the-shelf alternative.
SoC
When designing an ASIC, it often makes sense to integrate other parts of the circuit schematic onto the same silicon die. This is known as a System on Chip, which combines all the required analogue and digital functions
34 MAY 2023 | ELECTRONICS TODAY
of a typical IC, along with an embedded microprocessor.
This means the SoC is a complete electronic substrate system that may contain analogue, digital, mixed-signal and radio frequency functions with the added advantage of a powerful processor at its core.
The main driver for this level of integration in a sensor is reduced size and lower bill of materials cost. To illustrate this, let’s look at proximity sensors as an example. Many of these sensors are no bigger than a finger, including sensor element and PCB sealed in a waterproof enclosure.
Some 20 years ago, this level of integration would have been very challenging and out of reach for most companies, due to its cost and complexity. Now, alternatives such as SoC make fabricating these sensors far more accessible.
SiP
However, sometimes it is not possible to integrate all the system features into a single die and this is where a System in Package (SiP) comes to the fore. A SiP is typically an ASIC in bare die form that’s integrated with another IC, for example a microelectromechanical sensor (MEMS) or a communications die such as BLE, all in a single package.
The ASIC provides the signal processing and sensor interface, while the MEMS acts as the sensing element and the BLE for a complex communications protocol.
Where a SoC refers to the encapsulation of CPUs, micro-controllers and other supporting hardware onto a single chip, a SiP is a further level of integration where multiple dies are integrated inside a single package. While a SoC contains all the required electronic elements, a SiP comprises individual chips accommodated in one package, each with a specific functionality. The result is a chip that provides considerable space savings and lower installation costs.
Dies containing the ICs can be stacked
vertically on the substrate, connected by fine wires bonded to the package. Where a manufacturer would have needed multiple specialised IC devices to be assembled and connected on a PCB, that level of connectivity can be integrated into the package itself with a SiP.
One of the most notable advantages of using a SiP is its small size. Since a SiP uses IC manufacturing processes along with bare silicon die, it significantly reduces the size of the subsystem. This reduction in size allows designers to reduce the size of their PCB, supporting form factors that wouldn’t otherwise be possible. Furthermore, reduced assembly, PCB and materials costs will also make SiP more affordable, further increasing its accessibility.
For a manufacturer wanting to integrate more sophisticated, sensor-driven technology into their product, they may be pleased to know there are several options available at their fingertips. ASIC, SoC and SiP can all offer a multitude of performance gains that will help a product stand out from the competition. Knowing which option to choose, however, will require guidance from an expert in the design, test and supply of these integrated circuits.
Swindon Silicon Systems
www.swindonsilicon.com
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