CONTRACT MANUFACTURING Thermography in electronics
and electrical engineering The use of infrared thermography in electronics and electrical industry allows contactless measurement of surface temperatures with an infrared camera without contacting temperature sensors.
I
t is an elegant, non-invasive optical temperature measurement method for simultaneous and temporally high- resolution detection of a number of measurement points.
The thermographic inspection of electronic components and assemblies is an established test procedure for failure detection and quality management – from the development of first prototypes to serial production.
Thermographic analysis during each development step provides important conclusions for the optimisation of heat management and the design of complex electronic assemblies. In electronics production thermographic temperature measurement is used as a versatile instrument for quality assurance. High-performance thermography has become indispensable for setting critical technological parameters and their permanent monitoring as well as for inline testing of products in the production process and their final functional test.
Advantages when using powerful thermographic systems
Detector resolutions up to (1,920 × 1,536) native IR pixels for testing complex assemblies;
Capturing of high-resolution detail images with pixel sizes up to < 1 μm using specific microscopic lenses;
Detection of temperature differences between defective and intact structures in the range of a few micro-Kelvin due to high thermal resolution up to < 0.015 K in combination with the lock-in method; and Measurement accuracy of up to ± 1 °C or 1 % for accurate measurement results.
Individual Configuration of Thermographic Systems for Electronics and Electrical Engineering
Depending on the respective task, users can get the equipment configured meeting their specific needs. The starting point will usually be the thermographic camera. Cooled or
14 MAY 2023 | ELECTRONICS TODAY
uncooled detector? Which detector format? Shall the thermographic system support lock-in thermography? How much flexibility is desired for the distance between the measurement object and the camera?
Electronic/Semiconductor testing solution – E-LIT
E-LIT – Lock-In Thermography for electronics is an automated testing solution system (as part of NDT techniques) which allows non-contact (electrical) failure analysis of semiconductor material during the manufacturing process.
Inhomogeneous temperature distribution, local power loss, leakage currents, resistive vias, cold joints, latch-up effects and soldering issues can be measured with Lock-in Thermography.
This is achieved by using the shortest measurement times combined with a high- performance thermographic camera and a specialised lock-in procedure. The power supply for this process is clocked with a synchronisation module and failures that produce mK or even µK temperature differences are reliably detected by the Lock-in Thermography system.
Smallest defects at electronic components like point and line shunts, issues from overheating, internal (ohmic) shorts, oxide defects, transistor and diode failures on a PCB surface, in integrated circuits (IC´s), LED modules and battery cells can be detected and displayed in x and y positions. Additionally, it is possible to analyse stacked- die packages or multi-chip modules in z-direction with merely changing the lock-in frequency.
The powerful Lock-in Thermography software uses the latest algorithms and routines from most recent scientific publications.
E-LIT is extremely powerful also in resolving smallest geometrical structures as it can be equipped with strong microscopic lenses and additional SIL lenses. Identifying smallest structures with InfraTec´s E-LIT does not mean that the resulting field of view will also be smallest – implementing thermal cameras with detector sizes of up to (1,920 x 1,536) pixels provide large scale microscopic imaging. Larger imaging stitching options are available.
Quantum Design
www.qd-uki.co.uk
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40 |
Page 41 |
Page 42 |
Page 43 |
Page 44 |
Page 45 |
Page 46