PROJECT SPICE - HEATING UP THE POWER SUPPLY SECTOR N


exeon, battery material specialist, is spearheading a scheme to optimise coating technology for its silicon material. Dubbed SPICE – ‘silicon product improvement through coating enhancement – it is hoped it will improve the surface morphology, conductivity of the underlying anode material and the capacity of the battery during charge/ discharge cycles.


Nexeon has already established a laboratory scale coating process for its silicon anode material, scaling up high value materials to mass production and drawing on the Oxford University Department of Materials’ expertise in understanding what is happening at the molecular level: assessing the uniformity, quality and performance of the special coating, using the UK’s most advanced


equipment of its type for this purpose. “This is an important step in the development of silicon battery materials”, said Dr Scott Brown, CEO of Nexeon: “Using an optimised coating poses several performance advantages, and will further strengthen the case for the adoption of silicon anode technology by OEMs and battery makers globally.” www.nexeon.co.uk


CADENCE AND TOSHIBA COMBINE FOR ADAS CHIP


LOANING TECHNOLOGY TO STUDENTS PULSONIX’S DONATION PROLIFERATES TECHNOLOGICAL ANALYSIS


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oshiba, specialists in digital and infrastrutural electronics,


has implemented Cadence’s Tensilica Vision P6 DSPs for its automotive SoC: as safety standards tighten, Toshiba turns to Cadence’s embedded technology to assist in meeting these requirements. The Vision P6 DSP is designed to issue an effective throughput, with lower power consumption and resultingly, a strong partner ecosystem: its power efficiency exceeds previous measurements by 3.8 times. Toshiba hopes that this will benefit its ADAS chip. “The Cadence Tensilica


Vision P6 DSP offered a strong performance as the image recognition processor, in our next-generation ADAS chip. This DSP enabled us to execute complex algorithms for accurate detection and identification of a wide range of objects, while consuming very low power, which is crucial for today’s automotive applications” reported Nobuaki Otsuka, technology executive at Toshiba.


Cadence Toshiba www.cadence.com www.toshiba.com 8 JUNE 2019 | ELECTRONICS


nnovation is the almighty testament of the electronics industry. Students are the candidates that are most likely to take up the challenge to develop resourcefully. And Pulsonix recognises the potential for this plan: the engineering design software specialist has donated £9.5 million’s worth of equipment to NMiTE, a project founded for the purpose of establishing an engineering


university in Hereford. Moreover, Pulsonix looks to contribute 1,200 licences over the next four years, with the extended, helpful


provision of its range of PCB design and test software. Bob Williams, MD of Pulsonix, said: “When launched, NMiTE will be a dedicated engineering university, offering a fresh and much-needed approach that will help ensure more young people are attracted to this strategically important profession. That is why Pulsonix is supplying support to this important initiative, for the sake of the UK’s engineering sector and indeed the whole UK economy.” Toby Kinnaird, NMiTE’s engineer in residence, added:


“This donation of software, worth £9.5 million from Pulsonix, is a major and


generous contribution to the success of NMiTE. As the future of engineering is enabled through the increasing embedding of electronics, for capturing data used in control and AI, and for connectivity with


the spread of the Internet of Things and the implementation of Industry 4.0, Pulsonix’s software proves invaluable for work on leading-edge areas such as automated vehicles, 5G or other high-speed, embedded design projects”


Pulsonix www.pulsonix.com


FORM-IN-PLACE FOAM GASKET SERVICE IS SET TO EXPAND


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echsil has announced a 25 per cent increase in production capacity, following a growth in demand for its Form-in-Place Foam Gasketing (FIPFG) service. Using a single-component liquid polyurethane foam sealing system and machine technology, Techsil’s service aims to replace labour intensive peel and stick gasket


applications in the long run, within industries such as automotive lighting, electrical enclosures and packaging. Steve Green, business development manager, said that it is designed to increase “flexibility in achieving the functionality of a design engineer’s part”. A new day lab facility is available also, for customers wanting to work on their own prototypes. You can read more about Techsil’s FIPFG service by contacting one of their specialists through this email: technical@techsil.co.uk Or visit:


www.techsil.co.uk / ELECTRONICS


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