TECHNOLOGY IN ACTION ADVERTORIAL


4G-enabled I/O communication modules


remote control and maintenance solutions for decentralized applications. If no 4G network is available, the modules automatically fall back on 3G or 2G networks. Users can enhance the GSM-PRO2 module by adding inputs and outputs using I/O extension modules. The basic GSM- PRO2E device features four relay outputs and 10 inputs. I/Os can be configured for digital (24V DC) or analog (0...10V and 0[4]...20mA) signals, as required. The manufacturer supplies suitable models for the European as well as the US market. GSM-PRO modules automatically alert users via text or email messages when the monitored process reaches a defined state or preset limits are exceeded. Control-room staff or service technicians can switch the digital relay outputs of the GSM-PRO2 via text messages. The devices' log functions enable tracking of communications, process values of the analog inputs, and I/O activation events over freely programmable periods of time. Log files can be read out via a USB interface or sent to an email address.


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CONTA-CLIP u christian.quade@conta-clip.de u www.conta-clip.com


ntroducing GSM-PRO2 and GSM-PRO2E communication modules, CONTA-CLIP presents economic 4G wireless


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IBASE Releases New Wide-Temperature COM Express Modules


BASE Technology, a manufacturer of application specific industrial embedded computing platforms, introduces its latest COM Express Type 10 (ET875) and Type 6 (ET870) COM Express Modules based on the Intel® Atom™ processor E3900 series, Intel® Pentium® processor N4200 and Intel® Celeron® processor N3350.


Designed for the needs of IoT embedded applications including amusement gaming, ATM/POS, medical imaging, and industrial control, these highly scalable mini modules combine powerful graphics performance and energy-efficient computing power to effortlessly handle various tasks. The ET875 and ET870 have a wide-temperature operating range from -40°C to +85°C and long-term availability, while supporting two serial ports, four high-speed PCI-e Gen2 lanes and TPM 2.0 for data encryption management.


Measuring 84mm by 55mm, the new ET875 is equipped with the Intel® Gen 9-LP SoC-integrated HD graphics with 18 execution units and supports two independent displays - 1x DD and 1x LVDS or 1x eDP and eMMC storage option (up to 32GB). Its interfaces comprise two USB 3.0/3.1, eight USB 2.0, and two SATA III (via IP417 carrier board). The compact ET870 (95mm x 95mm), on the other hand, has three USB 3.0, four USB 2.0 and two SATA III (via IP419 carrier board). It features the Intel Gen 9 SoC-integrated HD graphics, and two display interfaces - 2x DDI and 1x 24-bit dual-channel LVDS or eDP.


You can find more information on both products at https://www.ibase-europe.com


IBASE Europe u 01438 846 090 u www.ibase-europe.com


Problem solved: Discontinued passives and long lead times with current components


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o help engineers and buyers in the Electronic Components Industry with End-of-Life (EoL) issues and today’s long lead times for current products, BEC Distribution has announced the availability of direct alternatives to


TOKO/Murata, Coilcraft, Vishay and Sumida lines, with short lead times of 6-8 weeks, where most manufacturers are currently working on 16-30 weeks.


BEC’s range of EoL replacements and pin-for-pin replacements for current passives includes: shielded power inductors, multi-layer ceramic chip inductors, radial peaking coils, open wire-wound chip inductors and thin-film chip inductors.


Typically, large component manufacturers discontinue product lines after 5-10 years. This can have a potentially disastrous impact on customers whose products have longer expected lifetime eg Aerospace, Medical, Surveillance or Defence industry equipment. The availability of BEC’s component replacements will far exceed 10 years.


BEC Distribution’s EoL component supplies will be a lifeline to R&D engineers and buyers, where components have been designed into their product lines. With a stock of 15m passive components and franchised distribution agreements with quality alternative component manufacturers, BEC can provide high quality, pin-for-pin direct replacement or alternatives. If the required components are not in stock, then BEC will track down and source matching alternatives, ensuring that EoL issues will not hinder customers’ projects.


With support from BEC, engineers and buyers alike can plan ahead right from the beginning when components are first used or when they are designed-in, ensuring that EoL does not necessarily mean end of supply or support.


BEC Distribution offers drop-in alternates for most manufacturers including Toko, Sumida, Murata, TDK, Coilcraft, Cooper, Bourns, Vishay, Wurth … etc.


BEC Distribution u 0845 4900 405 CONNECTINGINDUSTRY.COM/ELECTRONICS u www.bec.co.uk


Lattice’s New MachX03D FPGA


MachXO3D FPGA for securing systems against a variety of threats. Unsecured systems can lead to data and design theft, product cloning and overbuilding, and device tampering or hijacking. With MachXO3D, OEMs can simplify the implementation of robust, comprehensive and flexible hardware-based security for all system components. MachXO3D can protect, detect and recover itself and other components from unauthorized firmware access at every stage of a system’s lifecycle, from the point of manufacturing all the way to the system’s end of life. Component firmware is an increasingly popular attack


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vector for cyberattacks. In 2018, security vulnerabilities rendered over 3 billion chips in systems of all types vulnerable to data theft via the exploitation of firmware vulnerabilities. Unsecured firmware also exposes OEMs to the financial and brand reputation risks associated with device hijacking (for use in DDoS attacks) and device tampering or destruction. Failure to address these risks can negatively impact a company’s reputation and financial performance.


Lattice Semiconductor u 503-268-8512 u www.latticesemi.com


ELECTRONICS | JUNE 2019 39


attice Semiconductor Corporation (NASDAQ: LSCC), the low power programmable leader, today announced the


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